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An ultra-thin vapor chamber with gradient copper fiber capillary core mesh

A copper fiber and capillary core technology is applied in the field of ultra-thin vapor chambers to achieve the effects of improving mechanical strength, optimizing heat and mass transfer effects, and reducing tube wall thickness requirements

Active Publication Date: 2021-04-06
WUHAN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the design and development of an ultra-thin soaking liquid cold plate with a thickness below 0.4 mm is still being explored, and there is still a huge room for improvement in its performance.

Method used

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  • An ultra-thin vapor chamber with gradient copper fiber capillary core mesh
  • An ultra-thin vapor chamber with gradient copper fiber capillary core mesh
  • An ultra-thin vapor chamber with gradient copper fiber capillary core mesh

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] Such as figure 1 As shown, an ultra-thin vapor chamber with a gradient copper fiber capillary core mesh provided in this embodiment includes a board body 1 , and the board body 1 includes a first board body 11 and a second board body 12 . Wherein, the board body 1 is selected to have a length of 80 mm, a width of 60 mm, and a board wall thickness of 0.4 mm. figure 2 for figure 1 A cross-sectional view of an ultra-thin vapor chamber with a gradient copper fiber capillary mesh along line A-A shown.

[0037] In this embodiment, a copper fiber capillary core mesh 2 is provided between the inner surfaces of the first plate body 11 and the second plate body 12 . The first plate body 11 presses downward to form a concave cavity area, and the second plate body 12 presses upward to form a convex cavity area.

[0038]A steam channel 3 is formed between the first plate body 11 and the second plate body 12 and the copper fiber capillary core net 2 . The copper fiber capillar...

Embodiment 2

[0042] Such as Figure 5 As shown, the difference between this embodiment and Embodiment 1 is that in this embodiment, there are multiple groups of internal straight-edged capillary cores 221 in the ultra-thin vapor chamber, and the width Y of the steam channel 3 is kept at 3-8mm. In some cases, according to the specific heat dissipation space and requirements, the number of internal straight-edged capillary cores 221 is increased, and the width of the ultra-thin vapor chamber is increased. This design is a linear extension of the original design. Under the same thickness of the chamber, the heat transfer effect can be improved by increasing the width of the chamber.

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Abstract

The invention relates to the technical field of heat dissipation of a vapor chamber, and provides an ultra-thin vapor chamber with a gradient copper fiber capillary core net, comprising a first plate body and a second plate body, and the inner surfaces of the first plate body and the second plate body are A copper fiber capillary core mesh is provided; a steam channel is formed between the first plate body and the second plate body and the copper fiber capillary core mesh, and the copper fiber capillary core mesh is woven and sheared to form a steam channel; the copper The fiber capillary core net is formed by stacking multiple layers of copper fiber nets; the multi-layer copper fiber net includes a bottom layer copper fiber net and a middle layer copper fiber net; A copper fiber, the middle layer copper fiber mesh is formed by cross-weaving a plurality of copper fiber bundles, and the copper fiber adopts the second copper fiber. The ultra-thin soaking plate of the invention has the advantages of strong capillary force, low flow resistance, good heat transfer effect and high mechanical strength, can achieve effective heat dissipation under high heat flux density, improve the heat dissipation effect of electronic devices, and improve its working performance.

Description

technical field [0001] The invention relates to the technical field of vapor chamber heat dissipation, in particular to an ultra-thin vapor chamber with a gradient copper fiber capillary core net. Background technique [0002] With the development of 5G / 6G communications, notebook computers, data centers, aviation equipment, AI equipment and other product structures towards lighter, thinner and smaller, and processors towards higher speed and higher power; electric vehicle lithium batteries, LED lights, industrial inverters, transformers , motor equipment, etc. are developing towards higher power, and the problems caused by the heat generation are becoming more and more serious, which puts forward higher requirements for the equipment cooling system. For example, in 4G mobile phones, with the increase of applications, the miniaturization of chips and the acceleration of processing speed, the heat production increases, and ultra-thin heat pipes have begun to be applied to the...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F28D15/04F28F3/00F28F21/08
CPCF28D15/046F28F3/00F28F21/085
Inventor 吴永佳明廷臻陈森
Owner WUHAN UNIV OF TECH
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