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Unsealing method for silver wire plastic package device

A silver wire and device technology, applied in the field of unsealing electronic components, can solve the problems of strong corrosion of silver wire, low corrosion of silver wire, damage of silver wire, etc., so as to ensure the stability of unsealing and prevent the corrosion of silver wire. , Stabilize the effect of silver wire being corroded

Inactive Publication Date: 2020-05-01
QINGDAO GOERTEK MICROELECTRONICS RES INST CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The object of the present invention is to provide a method for unsealing a silver wire plastic-sealed device. The method has good unsealing stability and is less corrosive to silver wires, which solves the problem that the existing unsealing method is highly corrosive to silver wires and easily leads to silver The problem of thread damage (such as thinning) or even breaking

Method used

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  • Unsealing method for silver wire plastic package device
  • Unsealing method for silver wire plastic package device
  • Unsealing method for silver wire plastic package device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0046] Unpacking of plastic packaging materials that are easily corroded by fuming nitric acid

[0047] 1.1 Test the influence of the choice of unsealing solution on the silver wire.

[0048] The specific composition of the unsealing solution and the use temperature of the unsealing solution are shown in Table 1 below.

[0049] The formula composition of each test example in the embodiment 1 of table 1

[0050]

[0051]

[0052] For the unpacking of the silver bonding wire whose plastic sealing material is EMC-9200 plastic sealing material and the diameter of the silver bonding wire is 20.2μm:

[0053] First use laser unsealing to remove part of the plastic packaging material to expose the arc of the silver wire (such as figure 1 shown), and then respectively use the unsealing solution in Table 1 to act on the plastic sealing material to unseal the silver wire, and the unsealed effects are respectively as follows Figure 1-3 and Table 2-3.

[0054] in, Figure 2-4 I...

Embodiment 2

[0073] For plastic sealing materials that are difficult to be corroded by fuming nitric acid

[0074] 2.1 Test the influence of the choice of unsealing solution on the silver wire.

[0075] Formulation and unpacked form of each test example in table 5 embodiment 2

[0076]

[0077]

[0078] For the unpacking of the silver bonding wire whose plastic sealing material is G1250 plastic sealing material and the diameter of the silver bonding wire is 16.8μm:

[0079] First use laser unsealing to remove part of the plastic packaging material to expose the arc of the silver wire, and then use the unsealing solution in Table 5 to unseal the silver welding wire respectively. The unsealing effects are as follows: Figure 4-7 And shown in Table 5.

[0080] in, Figure 6-9 Followed by the mixture of fuming nitric acid+silver nitrate (solid state) as unsealing liquid, mixed acid (fuming nitric acid: oleum=5:1)+silver nitrate (solid state) as unsealing liquid, mixed acid (fuming nit...

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Abstract

The invention discloses an unsealing method for a silver wire plastic package device. The unsealing method comprises the following steps that laser unsealing is used for removing part of plastic package materials; and acid-containing liquid containing silver is used as unsealing liquid to remove the remaining plastic package materials, and unsealing of the silver wire plastic package device is achieved. The method is good in unsealing stability and small in corrosion to silver welding wires, and the problem that an existing unsealing method has high corrosion to the silver welding wires, and consequently the silver wires are prone to being damaged (such as thinning) and even broken is solved.

Description

technical field [0001] The invention relates to the technical field of electronic component unsealing. More specifically, it relates to an unsealing method for a silver wire plastic-encapsulated device. Background technique [0002] Because the hardness of the silver wire is lower than that of the copper wire, and the reliability is equivalent to that of the copper wire. More and more packaging companies choose to use silver wire as the wire material. [0003] In terms of failure analysis methods, since silver bonding wires are as easily corroded by chemical reagents used for unsealing as copper bonding wires, the problem of chemical unsealing of silver bonding wire products has become a problem that has to be solved. [0004] The current unsealing method for silver wire plastic-encapsulated devices is generally to use fuming nitric acid to heat and remove the plastic sealing material covering the silver wire, so as to chemically unseal the silver wire. However, fuming nit...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N1/32G01N1/44
CPCG01N1/32G01N1/44
Inventor 李彬彬侯敬雷郭峻诚
Owner QINGDAO GOERTEK MICROELECTRONICS RES INST CO LTD
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