Preparation method of solder for magnetron cathode assembly

A technology of magnetron cathode and configuration method, applied in welding/cutting medium/material, welding medium, welding equipment, etc., can solve problems such as difficulty in ensuring consistent filling, increased probability of filament deviation, unfavorable filling, etc. Waste, improved yield, improved field work environment effectiveness

Active Publication Date: 2020-05-05
佛山市海欣光电科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

There are many disadvantages in using powder metallurgy to press the solder ring: 1. The single weight of the solder is very small, about 10mg, and the pressed solder ring has a thin-walled structure with low strength, which is not conducive to filling into the groove of the end cap; 2. Thin Wall structure products adopt powder metallurgy to suppress a high failure rate, resulting in a large waste of materials; 3. Thin-wall structure products are difficult to ensure that the filling of each part is consistent when pressing and filling, causing inconsistent shrinkage, and the probability of filament deviation during use is greatly increased.

Method used

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  • Preparation method of solder for magnetron cathode assembly

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Embodiment approach

[0012] A method for configuring solder for a magnetron cathode assembly, the steps are as follows: (1) material selection: select molybdenum powder with an average particle size of 10 μm and silicon powder with an average particle size of 5 μm as solder raw materials; (2) proportioning: according to the weight ratio of 1: 11 Weigh 10g of silicon powder and 110g of molybdenum powder; (3) Grinding and mixing: Add silicon-molybdenum solder with a good ratio into a planetary ball mill for grinding for 36 hours. 10:1, the ball milling speed is set to 360r / min; (4) Configure the organic carrier: weigh 70g of epoxy resin, add 10g of epoxy resin diluent, stir and mix by mechanical stirring, the stirring speed is 1500r / min , Stirring time is 15min; add 45g of polyamide wax, continue to stir for 15min to prepare paste organic vehicle; (5) configure solder slurry: weigh 100g of ground silicon molybdenum powder, add 6g of prepared organic vehicle, add 8g of Ding Ester, stir and mix by mec...

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Abstract

The invention discloses a preparation method of a solder for a magnetron cathode assembly. The preparation method is characterized by comprising the following steps of (1) material selecting; (2) proportioning; (3) grinding and uniform mixing; (4) preparing of an organic carrier; and (5) preparing of solder slurry. The preparation method is simple in production process, low in cost and easy to realize automation.

Description

technical field [0001] The invention relates to the combined field of powder metallurgy and fine chemical industry, in particular to a method for configuring solder for magnetron cathode components. Background technique [0002] The core part of the magnetron is the cathode part, which mainly consists of thoriated tungsten filament and molybdenum support; as the heating body for microwave emission, its temperature is the highest. The thoriated tungsten filament is held in place between the support assembly and by solder brazing. When the magnetron is working, the temperature of the emitter can be as high as 1000°C, and the entire magnetron must work in a vacuum state. Therefore, the solder used is not allowed to contain elements with high vapor pressure and low melting point. Currently commonly used solders include ruthenium-molybdenum-nickel ternary system and ruthenium-molybdenum binary system, but both of these two systems contain rare and precious metal ruthenium, whic...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/40
CPCB23K35/40
Inventor 何达强
Owner 佛山市海欣光电科技有限公司
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