Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

A kind of epoxy resin modified high temperature resistant polyurethane potting glue

A technology of epoxy resin and high temperature resistance, applied in the field of potting glue, can solve the problems of cumbersome and inconvenient operation, affecting the use, and high viscosity of the final polymerization product, and achieves good heat resistance, good low temperature resistance and good processing performance. Effect

Active Publication Date: 2022-01-07
TECHSTORM MATERIAL TECH SHANGHAI CO LTD
View PDF8 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, if the heat resistance index reaches 155°C, the viscosity of the final polymerized product will be very high, which will make the operation process cumbersome and inconvenient, resulting in obvious defects in the potting product, which will affect the actual use.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A kind of epoxy resin modified high temperature resistant polyurethane potting glue
  • A kind of epoxy resin modified high temperature resistant polyurethane potting glue

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0059] A second aspect of the present invention provides a method for preparing the epoxy resin-modified high-temperature-resistant polyurethane encapsulant, comprising the following steps:

[0060] (1) Prepare component A earlier;

[0061] (2) Blend component A and component B in step (1), pour into a mold, solidify and form, and obtain the product.

[0062] Preferably, the preparation method of the epoxy resin-modified high-temperature-resistant polyurethane encapsulant comprises the following steps:

[0063] (1) Preparation of component A: Add the polyether epoxy resin into the reaction mixer, the stirring rate is 120-300r / min, the temperature is controlled at 90-130°C, the vacuum degree is -0.1-0MPa, and the stirring and dehydration is 1-4h ;

[0064] (2) Add isocyanate and the first component catalyst to step (1), control the temperature at 120-160° C., vacuum degree at -0.1-0 MPa, stirring rate at 120-300 r / min, and stir for 2-5 hours;

[0065] (3) Add component B to ...

Embodiment 1

[0068] Embodiment 1 of the present invention provides an epoxy resin-modified high-temperature-resistant polyurethane encapsulant. In parts by weight, the preparation raw materials include component A and component B; wherein, component A includes 60 parts of polyether epoxy Resin, 90 parts of isocyanate and 3 parts of the first component catalyst; B component includes polyol and 2 parts of the second component catalyst; the weight ratio of A component to B component is 6:1;

[0069] The polyether epoxy resin is 663 epoxy resin, DER663U;

[0070] The isocyanate is toluene diisocyanate;

[0071] The polyol is 7001 of Vertellus;

[0072] Both the first component catalyst and the second component catalyst are 1-methylimidazole;

[0073] The preparation method of the high temperature resistant polyurethane potting glue modified by epoxy resin comprises the following steps:

[0074] (1) Preparation of component A: Add the polyether epoxy resin into the reaction mixer, the stirri...

Embodiment 2

[0078] Embodiment 2 of the present invention provides an epoxy resin-modified high-temperature-resistant polyurethane potting glue. In parts by weight, the preparation raw materials include component A and component B; wherein, component A includes 10 parts of polyether epoxy Resin, 30 parts of isocyanate and 0.01 part of the first component catalyst; B component includes polyol and 0.05 part of the second component catalyst; the weight ratio of A component to B component is 1:1;

[0079] The polyether epoxy resin is 663 epoxy resin, DER663U;

[0080] The isocyanate is toluene diisocyanate;

[0081] The polyol is 7001 of Vertellus;

[0082] Both the first component catalyst and the second component catalyst are 1-methylimidazole;

[0083] The preparation method of the high temperature resistant polyurethane potting glue modified by epoxy resin comprises the following steps:

[0084] (1) Preparation of component A: Add the polyether epoxy resin into the reaction mixer, the s...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
epoxy valueaaaaaaaaaa
viscosityaaaaaaaaaa
viscosityaaaaaaaaaa
Login to View More

Abstract

The invention relates to the related field of potting glue, more specifically, the invention provides a high temperature resistant polyurethane potting glue modified by epoxy resin. In parts by weight, the preparation raw materials include A component and B component; wherein, A component includes 30 to 100 parts of isocyanate, 0 to 3 parts of the first component catalyst and 0 to 60 parts of polyether epoxy resin; B component It includes polyhydric alcohol and / or 0-3 parts of the second component catalyst; when the content of the first component catalyst is different from that of the second component catalyst, it is 0. The epoxy resin-modified high-temperature-resistant polyurethane potting adhesive provided by the present invention has good heat resistance and good processing performance, and the obtained potting product has no defects; it can be placed at 220°C for 200H, potting The product does not break, and the obtained potting product also has good low temperature resistance.

Description

technical field [0001] The invention relates to the related field of potting glue, and more specifically, the invention provides a high-temperature-resistant polyurethane potting glue modified by epoxy resin. Background technique [0002] Polyurethane potting adhesive is a kind of polymerized polyether (or polyester) polyol as soft satin and isocyanate as hard segment. Due to the large polarity difference and incompatibility between the soft satin and the hard segment, a special microphase separation structure of the soft satin and the hard segment is formed. This microphase separation structure can endow the polyurethane material with better heat resistance at low hardness. It has been widely used in automotive electronics, potting and sealing of electronic components and other fields. [0003] With the development of the field of automotive electronics to the field of high heat resistance, higher requirements are put forward for the thermal and mechanical properties of th...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): C09J175/04C08G18/58
CPCC09J175/04C08G18/58
Inventor 魏冬吉明磊陈翠萍
Owner TECHSTORM MATERIAL TECH SHANGHAI CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com