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Rapid bonding method of multilayer film material

A multi-layer film and film material technology, applied in the field of card production, can solve the problems of long time consumption, low efficiency, irreversibility, etc., and achieve the effect of improving efficiency, avoiding apparent pollution, and realizing automatic binding

Inactive Publication Date: 2020-05-08
THE FIRST RES INST OF MIN OF PUBLIC SECURITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to improve the binding efficiency of multi-layer materials, some kinds of film materials can be prefabricated and bound in advance. The bonding process of binding multi-layer film materials generally adopts hot pressing or adhesive bonding in the card production industry. However, these two methods take a long time, are relatively inefficient, and are generally irreversible.
There is no other method to realize the tight bonding between the prefabricated layers of materials, without destroying the surface properties of the materials, and the function of reversible peeling

Method used

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  • Rapid bonding method of multilayer film material
  • Rapid bonding method of multilayer film material
  • Rapid bonding method of multilayer film material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0017] A kind of fast bonding method of multi-layer thin film material, comprises the steps:

[0018] S1. Stack the layers of film materials to be bonded together in order on the grounded platform;

[0019] S2. Apply an electrostatic voltage to the surface of each layer of film materials stacked together, and each layer of film materials is closely bonded under the action of static electricity.

[0020] The bonded layers of film materials can be manually or mechanically moved to the next station for the next step of multi-layer binding alignment or multi-layer thermocompression bonding. In this process, due to the effect of static electricity, the layers of film materials will not be separated, which is convenient for the production operation of multi-layer film materials as a whole, and is convenient for automatic binding and alignment operations. There will be foreign pollutants entering between the layers of film materials, which is convenient for the apparent quality insp...

Embodiment 2

[0026] This embodiment provides an example based on the method described in Embodiment 1.

[0027] Such as figure 1 As shown, the layers of film materials 1 to be bonded are stacked together in sequence on a fixed grounded platform 2; after the electrostatic generator 3 is energized, an electrostatic voltage is applied to the stacked layers of film materials 1 . In this embodiment, the electrostatic generator 3 is hoisted above the grounded platform 2 with the mobile driving device 4 (the distance between the two is no more than 1000 mm), and its longitudinal length is greater than or equal to that of the layers of films stacked together. The longitudinal length of the material 1, when an electrostatic voltage is applied, the electrostatic generator 3 moves laterally to apply an electrostatic voltage (200v-100000v) to the stacked layers of film material 1 comprehensively and uniformly, and each layer of film material is tightly packed under the action of static electricity. ...

Embodiment 3

[0029] This embodiment provides another example based on the method described in Embodiment 1.

[0030] Such as figure 2 As shown, each layer of card film material 1 (the number of layers is 2-10, which can be printing layer, anti-counterfeiting layer, protective layer, leveling layer, transparent layer, portrait layer, INLAY layer, etc.) is stacked in a predetermined order Put them together and place them on a movable grounded platform 2; the electrostatic generator 3 is hoisted above the platform 2 by the fixing device 4, and its distance from the surface of the uppermost film material is no more than 1000mm at most, and its longitudinal length is greater than Or equal to the longitudinal length of each layer of film material 1 stacked together. After the electrostatic generator is energized, an electrostatic voltage (200-100000v) is generated, and the platform moves laterally toward the electrostatic generator, so that the electrostatic generator applies the electrostatic...

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PUM

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Abstract

The invention discloses a rapid bonding method of a multilayer film material; the film material is prefabricated by electrostatic bonding, that is, layers of film material needing to be prefabricatedor bonded together are bonded together by using an electrostatic technology, and then binding or hot-pressing bonding is carried out. According to the technology, a prefabricated layer can be conveniently and quickly manufactured; rapid compounding of multiple materials is realized; the bookbinding efficiency can be improved; automated bookbinding is achieved, inspection can be carried out beforefinal hot-pressing compounding, when pollution inside or on the surface of a certificate card is found, the thin film material can be separated in time, pollutants inside or on the surface of the prefabricated layer or the certificate card can be removed in time, apparent pollution of a finished certificate card after final lamination is effectively avoided, and the production automation level andthe product yield are greatly improved.

Description

technical field [0001] The invention relates to the technical field of card production, in particular to a fast bonding method for multilayer film materials. Background technique [0002] With the increasing application of various certificates and the continuous development of certificate technology, most of the final molding of the card adopts the hot pressing lamination method, that is, the multi-layer materials are bonded together to form various cards. A variety of sheet materials used in cards include card base materials, printing layers, anti-counterfeiting layers, portrait layers, etc. In addition, in order to ensure the alignment of the front and back of the card, the alignment of the front and back of the cursor line is often used to achieve the purpose of accurate compounding of multi-layer materials. In the actual operation process, because of the different contents and functions of each layer of materials, multi-layer materials (sheets or coils) are often bound ...

Claims

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Application Information

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IPC IPC(8): B32B37/00
CPCB32B37/00
Inventor 王成霍玉洁翁楠昌宋慧强周利殷月磊秦鑫白雪峰
Owner THE FIRST RES INST OF MIN OF PUBLIC SECURITY