Phenolic molding compound for supporting contactor contact
A phenolic molding compound, contact support technology, applied in the field of thermosetting plastics, can solve problems such as easy "bulging", contact support stuck, product failure, etc., to achieve the effect of improving thermal conductivity
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example 1
[0021] 25 parts of phenolic resin;
[0022] 25 parts of glass fiber;
[0023] 20 parts of organic fiber (para-aramid fiber);
[0024] 5 parts of thermal modifier (sericite and boron nitride 7:3 high-temperature sintered powder);
[0025] Curing agent (hexamethylenetetramine) 2 parts;
[0026] 0.5 parts of curing accelerator (magnesia);
[0027] Lubricant (2 parts zinc stearate + 1 part stearic acid) 3 parts;
[0028] Flame retardant (10 parts of aluminum hydroxide + 5 parts of magnesium hydroxide) 15 parts.
example 2
[0030] 35 parts of phenolic resin;
[0031] 15 parts of glass fiber;
[0032] 15 parts of organic fiber (para-aramid fiber);
[0033] 10 parts of heat modifier (sericite and boron nitride 7:3 high-temperature sintered powder);
[0034] 5 parts of curing agent (hexamethylenetetramine);
[0035] 1 part of curing accelerator (magnesium oxide);
[0036] Lubricant (zinc stearate) 2 parts;
[0037] Flame retardant (10 parts of aluminum hydroxide + 10 parts of magnesium hydroxide) 20 parts.
example 3
[0039] 45 parts of phenolic resin;
[0040] 5 parts glass fiber;
[0041] 5 parts of organic fiber (para-aramid fiber);
[0042] Thermal modifier (sericite and boron nitride 7:3 high-temperature sintered powder) 15 parts;
[0043] Curing agent (hexamethylenetetramine) 8 parts;
[0044] 2 parts of curing accelerator (magnesium oxide);
[0045] Lubricant (stearic acid) 1 part;
[0046] Flame retardant (15 parts of aluminum hydroxide + 10 parts of magnesium hydroxide) 25 parts.
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