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Thermosetting resin composition

A technology of resin composition and heat curing, applied in the direction of adhesive types, ester copolymer adhesives, unsaturated alcohol copolymer adhesives, etc., can solve the problem of unclear composition of the cured composition, and achieve low cost , high safety effect

Active Publication Date: 2020-05-15
KYOEISHA CHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this document, the detailed composition of the resin used is not limited, and the composition suitable for the curing composition based on the transesterification reaction is not clear.

Method used

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  • Thermosetting resin composition
  • Thermosetting resin composition
  • Thermosetting resin composition

Examples

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Embodiment

[0266] Hereinafter, the present invention will be described in more detail based on examples. In addition, this invention is not limited to the following Example. It should be noted that the parts herein represent weight.

Synthetic example 1

[0268] A follow-up test was performed on the resin composition described in the prior art (Japanese Patent Application Laid-Open No. 9-59543). As a comparative resin, 375 parts of tert-butyl methacrylate (manufactured by Kyoeisha Chemical Co., Ltd.: Light Ester TB) and 125 parts of hydroxyethyl methacrylate (manufactured by Kyoeisha Chemical Co., Ltd.: Light Ester HO-250) were used. A monomer mixed liquid was prepared, and 25 parts of t-butyl peroxyoctanoate and 3 parts of 2,2'-azobisisobutyronitrile were dissolved in xylene as initiators to prepare an initiator solution. 500 parts of xylenes were charged into a stirring flask, and the monomer solution and the initiator solution were added dropwise while enclosing nitrogen gas. The polymerization temperature at this time was set to 130°C. It was dripped over 4 hours, and aging was performed at 130 degreeC for 10 hours, and the comparative polymer solution A was obtained.

Synthetic example 2

[0270] 240 parts of n-butyl methacrylate (manufactured by Kyoeisha Chemical Co., Ltd.: Light Ester NB), 110 parts of hydroxyethyl methacrylate (manufactured by Kyoeisha Chemical Co., Ltd.: Light Ester HO-250), and 30 parts of styrene 25 parts of 2,2'-azobis(2,4-dimethylvaleronitrile) (Wako Pure Chemical V-65) as initiator were dissolved in aromatic hydrocarbon (T- In SOL 100), make initiator solution. 250 parts of aromatic hydrocarbons (T-SOL100) and 250 parts of cyclohexanone were charged into a stirrable flask, and the monomer solution and the initiator solution were added dropwise while enclosing nitrogen gas. The polymerization temperature at this time was set at 100°C. It was dripped over 2 hours, and aging was performed at 100 degreeC for 4 hours, and the polyol A was obtained.

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Abstract

Provided is an inexpensive thermosetting resin composition having suitable curability and in which the curing reaction is transesterification that makes it possible to use said thermosetting resin composition for a variety of uses. The thermosetting resin composition contains (A) an ester compound having at least two alkyl ester groups in the molecule thereof, a compound (B) having at least two hydroxyl groups in the molecule thereof, and (C) a transesterification catalyst (C).

Description

technical field [0001] This invention relates to the thermosetting resin composition which uses transesterification reaction as a curing reaction. Background technique [0002] Various thermosetting resin compositions are used in applications such as coatings and adhesives. In such thermosetting resin compositions, a resin having two or more hydroxyl groups is often used together with a curing agent, and the resin is cured by a crosslinking reaction between the curing agent and the hydroxyl groups. [0003] As such curing agents, melamine resins, epoxy compounds, and polyisocyanate compounds are commonly used. These curing agents have good thermal reactivity and excellent properties of the resulting cured resin, and thus are generally widely used. However, melamine resin is considered to be a cause of sick building syndrome (Sick House Syndrome) due to the generation of formaldehyde, so its use may be limited in recent years. In addition, it is known that when using this ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L33/14C09D129/04C09D133/04C09D135/02C09J129/04C09J133/04C09J135/02
CPCC09D133/04C09J133/04C08G63/46C08G63/82C08J3/24C08J2367/07C08J5/18C09D129/04C09D135/02C09J129/04C08L33/14C09J135/02
Inventor 森胁佑也浅田耕资吞海克竹中直巳
Owner KYOEISHA CHEM CO LTD
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