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Surface preparation method capable of preparing various nanowire structures

A technology of nanowires and red copper, applied in the direction of nanotechnology, nanotechnology, nanotechnology for materials and surface science, etc., to achieve the effects of improving boiling heat transfer, diversifying structural forms, and strengthening condensation heat transfer

Active Publication Date: 2020-06-02
DALIAN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In summary, at present, researchers in related fields have used various methods to prepare copper nanowires, but the patents for preparing copper nanowires using the template method combined with electrochemical deposition methods are rarely reported. copper nano

Method used

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  • Surface preparation method capable of preparing various nanowire structures
  • Surface preparation method capable of preparing various nanowire structures
  • Surface preparation method capable of preparing various nanowire structures

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] Surface preparation of vertical, agglomerated, and pit-shaped copper nanowire structures

[0019] A. Take the copper block and polish it with sandpaper, put it in acetone, ethanol, and deionized water for 10 minutes, and then take it out and blow it dry with nitrogen.

[0020] B. In the fixture, put the plexiglass block, the copper block connected to the working electrode, the porous anodized aluminum template, the filter paper dripped with the electroplating solution, the copper block connected to the counter electrode, and the plexiglass block from bottom to top, and fully clamp Tight, template models 450-360, 450-280, 450-200, 450-110, 125-30, 65-10. The voltage setting of the electrochemical workstation is -0.8V, and the time setting is 900s.

[0021]D. The working selection of the three-electrode system: the distance between the copper block covered with the template and another copper block is 20mm, and the distance between the reference electrode and the two ele...

Embodiment 2

[0025] Surface preparation of vertical and agglomerated copper nanowires with different heights

[0026] A. Take the copper block and polish it with sandpaper, put it in acetone, ethanol, and deionized water for 10 minutes, and then take it out and blow it dry with nitrogen.

[0027] B. In the two-electrode system provided by the fixture, put in order from bottom to top the plexiglass block, the copper block connected to the working electrode, the porous anodized aluminum template, the filter paper dripped with electroplating solution, the copper block connected to the counter electrode, and the plexiglass Block, and fully clamped, the template model is 450-360, 450-200. The voltage setting of the electrochemical workstation is -0.8V, and the time setting is 900s.

[0028] C. In the three-electrode system provided by the electroplating pool, the distance between the cathode copper block and the anode copper block is 20mm, and the distance between the reference electrode and t...

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Abstract

The invention relates to a surface preparation method capable of preparing various nanowire structures, and belongs to the technical field of surface treatment. According to the method, a template-assisted electroplating method is utilized, and multiple structural shapes such as upright type, agglomeration type and round pit type can be formed by changing hole spacing, hole diameter and electroplating duration of the template, and the structure height and an included angle of the upright type and the agglomeration type can be changed. The height of nanowires is 4 microns-50 microns, the centerdistance of the nanowires is 60nm-500nm, and the diameter of the nanowires is 5nm-400nm. The surface shapes prepared by the preparation method are controllable, structural form is diversified, and cross-scale effect can be achieved, the upright type and the agglomeration type can be used for condensation and the round pit type can be used in the field of phase change heat transfer such as boiling.

Description

technical field [0001] The invention relates to a copper nanowire surface, in particular to a method for preparing a copper nanowire surface capable of forming vertical, agglomerated, and pit-shaped copper nanowire surfaces. The main feature is that it is prepared by electroplating with template assistance The surface of copper nanowires with different pitches and wire diameters can be used to effectively enhance the field of phase change heat transfer such as condensation and boiling due to its different structure and morphology, which belongs to the functional structure. Background technique [0002] How to improve the surface structure to maximize the effect of condensation heat transfer and boiling heat transfer has always been a research hotspot in the fields of thermal management and water collection. In the field of condensation heat transfer, the extremely small condensate droplets on the surface of nanostructures can cause coalescing to induce droplet bouncing and g...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D5/02C25D3/38B82Y40/00B82Y30/00
CPCB82Y30/00B82Y40/00C25D3/38C25D5/022
Inventor 马学虎杨思艳温荣福杜宾港于星瞳陶沿宪郝婷婷兰忠白涛
Owner DALIAN UNIV OF TECH
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