The utility model relates to a portable
refrigeration cup, and aims to solve the technical problem that the
refrigeration effect on a
semiconductor refrigeration assembly is improved by adopting a mode that a
heat pipe is arranged at the center in a cup body and a heat strip is arranged on an inner cavity shell in the cup body in the conventional similar products. The refrigeration cup is characterized in that at least one
heat transfer unit A extending out and located in the center of a cup cavity is arranged at the bottom in the cup cavity of a cup body of the refrigeration cup, a
heat pipe is arranged in the middle of the
heat transfer unit A, multiple sets of
semiconductor refrigeration assemblies are distributed on the outer wall of the
heat pipe at intervals around the circumference, and the hot ends of the
semiconductor refrigeration assemblies are in heat conduction connection with the outer wall of the heat
pipe; the cold end of the semiconductor refrigeration
assembly is in heat conduction connection with a heat conduction
pipe, a cavity between the heat
pipe and the heat conduction pipe except the semiconductor refrigeration
assembly is filled with heat insulation glue, the heat conduction pipe is in sealed connection with an inner cavity shell of the cup body, and a section of heat pipe at the bottom of the cup body is in heat conduction connection with a heat dissipation unit B; and a heat insulation material and another plurality of groups of semiconductor refrigeration assemblies are arranged between the inner cavity shell in the cup body and the cup body.