Single crystal semiconductor material processing equipment and use method thereof

A single crystal semiconductor and material processing technology, applied in the direction of using ultrasonic/sonic/infrasonic waves, measuring devices, instruments, etc., can solve the problem of high fragmentation rate, achieve the effect of increasing yield, high work efficiency, and avoiding waste of resources

Inactive Publication Date: 2020-06-05
HUAIBEI NORMAL UNIVERSITY
View PDF0 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a single crystal semiconductor material processing equipment and using method, which has the advantage of uniform sorting, and solves the problem of high fragmentation rate caused by human eye sorting in the existing thickness processing and sorting process

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Single crystal semiconductor material processing equipment and use method thereof
  • Single crystal semiconductor material processing equipment and use method thereof
  • Single crystal semiconductor material processing equipment and use method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0033] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0034] In conjunction with the accompanying drawings, a control box 2 is installed on one side of the lower part of the frame body 1; a conveyor belt 3 is installed on the upper end of the frame body 1, and a feeding box 6 is placed on the surface of the conveyor belt 3; Transmission device 4, the periphery of transmission device 4 at one end forms transmission connection with the output shaft end of first motor 5 through a transmission chain, wherein the shell...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses single crystal semiconductor material processing equipment and a use method thereof. The single crystal semiconductor material processing equipment comprises a frame body, wherein one side of the lower portion of the frame body is provided with a control box; a conveying belt is installed at the upper end of the frame body, wherein a feeding box is placed on the surface ofthe conveying belt; and a transmission device is installed on the inner circumference of the conveying belt, wherein the periphery of the transmission device at one end is in transmission connection with the output shaft end of a first motor through a transmission chain, and a shell of the first motor is fixed to the other side of the lower portion of the frame body through a stud. According to the single crystal semiconductor material processing equipment and the use method thereof, through arranging the conveying belt, a second conveying belt, a third conveying belt, the feeding box, a leadscrew linear guide rail and a thickness detector, stable thickness detection is formed, an accurate thickness value is obtained, so that the problems that in the prior art an error range generated bymanual sorting is large and that the fragment rate of abrasive sheets during working is high are solved, the finished product rate is increased, and use experience is optimized.

Description

technical field [0001] The invention relates to the technical field of single crystal semiconductor material processing equipment, in particular to a single crystal semiconductor material processing equipment and a use method. Background technique [0002] Substances and materials in nature can be divided into three categories: conductors, semiconductors, and insulators according to their electrical conductivity. Among them, semiconductor materials are a type of electrical conductivity between conductors and insulators, and their resistivity is about 1mΩ·cm~1GΩ·cm. It can be used to make electronic materials for semiconductor devices and integrated circuits. The basic chemical characteristic of semiconductors is that there are saturated covalent bonds between atoms. The permanent semiconductor material has the structure of diamond or sphalerite, and since most of the minerals on the earth are compounds, the compound has become the earliest semiconductor material used in the ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): B07C5/04B07C5/02B07C5/36G01B17/02
CPCB07C5/02B07C5/04B07C5/361B07C5/362G01B17/02
Inventor 张金锋代凯杨婉茹贾宏伟刘卓赵磊王栋林公丕锋
Owner HUAIBEI NORMAL UNIVERSITY
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products