Single crystal semiconductor material processing equipment and use method thereof

A single crystal semiconductor and material processing technology, applied in the direction of using ultrasonic/sonic/infrasonic waves, measuring devices, instruments, etc., can solve the problem of high fragmentation rate, achieve the effect of increasing yield, high work efficiency, and avoiding waste of resources
CN111229628AInactive Publication Date: 2020-06-05HUAIBEI NORMAL UNIVERSITY

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
HUAIBEI NORMAL UNIVERSITY
Publication Date
2020-06-05
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention discloses single crystal semiconductor material processing equipment and a use method thereof. The single crystal semiconductor material processing equipment comprises a frame body, wherein one side of the lower portion of the frame body is provided with a control box; a conveying belt is installed at the upper end of the frame body, wherein a feeding box is placed on the surface ofthe conveying belt; and a transmission device is installed on the inner circumference of the conveying belt, wherein the periphery of the transmission device at one end is in transmission connection with the output shaft end of a first motor through a transmission chain, and a shell of the first motor is fixed to the other side of the lower portion of the frame body through a stud. According to the single crystal semiconductor material processing equipment and the use method thereof, through arranging the conveying belt, a second conveying belt, a third conveying belt, the feeding box, a leadscrew linear guide rail and a thickness detector, stable thickness detection is formed, an accurate thickness value is obtained, so that the problems that in the prior art an error range generated bymanual sorting is large and that the fragment rate of abrasive sheets during working is high are solved, the finished product rate is increased, and use experience is optimized.
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Description

technical field

[0001] The invention relates to the technical field of single crystal semiconductor material processing equipment, in particular to a single crystal semiconductor material processing equipment and a use method. Background technique

[0002] Substances and materials in nature can be divided into three categories: conductors, semiconductors, and insulators according to their electrical conductivity. Among them, semiconductor materials are a type of electrical conductivity between conductors and insulators, and their resistivity is about 1mΩ·cm~1GΩ·cm. It can be used to make electronic materials for semiconductor devices and integrated circuits. The basic chemical characteristic of semiconductors is that there are saturated covalent bonds between atoms. The permanent semiconductor material has the structure of diamond or sphalerite, and since most of the minerals on the earth are compounds, the compound has become the earliest semiconductor material used in the ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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