Crystal bar slicing device

Abstract

The invention provides a crystal bar slicing device. The device comprises a power supply, an electrolytic tank, an anode and a cathode; the electrolytic tank is used for storing electrolyte; the anodecomprises a crystal bar, and the crystal bar is electrically connected with the power supply; the cathode comprises at least one linear electrode, the linear electrode is contained in the electrolytic tank and electrically connected with the power supply, the length direction of the linear electrode and the axial direction of the crystal bar are arranged in a crossed mode, and the linear electrode does not make contact with the crystal bar; when the power supply is switched on between the anode and the cathode, the crystal bar is sliced through the relative movement between the linear electrode and the crystal bar; and an auxiliary convection device is also arranged in the electrolytic tank and is used for enhancing flow of the electrolyte in the electrolytic tank. According to the crystal bar slicing device disclosed by the invention, the auxiliary convection device is arranged in the electrolytic tank, so that flowing of the electrolyte in the electrolytic tank is enhanced, and influences of the condition that H2 is attracted to the linear electrode on the cutting rate and cutting quality of the crystal bar are reduced.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to a crystal rod slicing device. Background technique [0002] At present, the cutting of crystal ingots is mainly performed by mechanical wire cutting with steel wires driving slurry. The principle is that a high-speed moving steel wire drives the cutting blade attached to the steel wire to rub against the silicon rod, so as to achieve the cutting effect. Since steel wire is used in the wire cutting process, it is easy to introduce pollutants such as Cu and Fe. At the same time, cutting the ingot by wire cutting technology cannot avoid kerf loss. [0003] An improved ingot cutting method is to electrochemically cut the ingot by electrolysis. By setting the ingot and the wire electrode at the anode and the cathode of the electrolytic device containing the electrolyte at the same time, in the case of applying a DC power supply between the cathode and the anode, the wire ...

AI Technical Summary

Problems solved by technology

In this process, an electrochemical reaction of hydrogen evolution often occurs on the cathode set as a linear electrode, and the precipitated hydrogen is often adsorbed on the linear electrode, resulting in a decrease in the surface reactivity of the linear electrode, which reduces the electrochemical reaction efficiency of the subsequent ingot cutting. The drop cannot even be carried out, which affects the cutting effect of the ingot

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