Source bottle and semiconductor equipment

Abstract

The invention provides a source bottle and semiconductor equipment. The source bottle comprises a bottle body and a bottle cap fixedly installed on the bottle body, the bottle body and the bottle capcan form a closed space, the bottle cap is also provided with an air inlet pipe and an air outlet pipe which are in communication with the closed space, the air inlet pipe is used for introducing carrier gas into the closed space, and the air outlet pipe is in communication with the closed space, the air outlet pipe is used for outputting a reaction precursor and the carrier gas to the outside ofthe closed space, and the source bottle further comprises a tray, a cover plate and a lifting device, the tray is arranged in the closed space and used for loading a solid source; the cover plate is arranged opposite to the tray; the lifting device is used for driving the cover plate to descend to a first position for covering the solid source on the tray; or to a second position separated from the tray. According to the source bottle, the problems of insufficient steam concentration of the solid source and scattering of the solid source in the transportation and installation process are solved.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to a source bottle and semiconductor equipment. Background technique [0002] At present, thin film deposition reaction systems and methods are widely used in devices in various fields, such as: semiconductors, integrated circuits, solar panels, flat-panel displays, microelectronics, light-emitting diodes, and the like. Forming a thin film with a thickness of 10 μm or less than 10 μm on the surface of a substrate by chemical vapor deposition (Chemical Vapor Deposition, hereinafter referred to as CVD) technology is a common method for thin film deposition. However, in the film deposition method using atomic layer deposition (Atomic Layer Deposition, hereinafter referred to as ALD) technology, a variety of reaction gases or vapors are required to enter the reaction chamber successively and continuously in an alternative manner, and before entering the chamber, they cannot i...

AI Technical Summary

Problems solved by technology

[0005] While the solid powder source is loaded in the solid source bottle, the plane of the solid powder source may not be flat, and the solid powder source may be tilted, bumped, etc. during transportation, resulting in the uncertainty and guarantee of the shape of the solid powder source surface in the bottle, which leads to Using the same process parameters does not necessarily produce films with the same quality. Every time the source bottle is replaced, the process parameters need to be measured again, which is a waste of time, a large workload, and a long recovery time.

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