Manufacturing method of multilayer circuit board with high line alignment precision
A technology for multi-layer circuit boards and alignment accuracy, applied in multi-layer circuit manufacturing, printed circuit manufacturing, printed circuit, etc. Difficult to achieve bit accuracy and other issues, to achieve the effect of novel production methods, avoid adverse effects, and improve line alignment accuracy
Active Publication Date: 2020-06-30
JIANGSU PROVISION ELECTRONICS CO LTD
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Problems solved by technology
[0003] However, because the existing packaging substrate is limited by the existing manufacturing process and cannot continue to be adjusted down, it is mainly limited by the quality of the drill hole shape, which makes it difficult to achieve alignment accuracy ≤ 20 μm between connected layers
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Embodiment 1
[0048] The invention provides a method for manufacturing a multilayer circuit board with high line alignment accuracy, comprising the following steps:
[0049] Step 1), prepare a double-sided copper-clad substrate B0, the double-sided copper-clad substrate B0 is composed of an auxiliary substrate 10 and two ultra-thin carrier copper foils that are respectively laminated on the front and back sides of the auxiliary substrate 10 11, each of the ultra-thin carrier copper foils 11 has a layer of carrier copper foil 110 and a layer of ultra-thin copper foil 111 detachably arranged on the carrier copper foil 110, the ultra-thin Copper foil can be deposited on the carrier copper foil by electrodeposition processing, and the carrier copper foil must be treated accordingly before the electrodeposition operation to ensure that the carrier copper foil is compatible with the ultra-thin copper foil. Foils can be separated well; and the carrier copper foil 110 is also facing the auxiliary s...
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The invention discloses a manufacturing method of a multilayer circuit board with high line alignment precision. The manufacturing method comprises the following steps: preparing a double-sided copper-clad substrate; manufacturing a first copper column and a first alignment target; laminating a first insulating layer and carrying out first laser target burning and windowing operation; manufacturing a second copper column and a first copper foil; manufacturing a second circuit pattern and a second alignment target; laminating a second insulating layer and carrying out second laser target burning and windowing operation; manufacturing a third copper column and a second copper foil; manufacturing a third circuit pattern and a third alignment target; laminating a third insulating layer and carrying out third laser target burning and windowing operation; manufacturing a fourth copper column and a third copper foil; after a fourth circuit pattern is manufactured, carrying out board splittingto obtain a processing board I containing four layers of copper foils; and performing copper reduction and other conventional post-processing processes on the processing board I to complete the manufacturing of the multilayer circuit board with high line alignment precision. The manufacturing method is novel and reasonable, the processing efficiency is high, and the circuit alignment precision between connected layers is greatly improved.
Description
technical field [0001] The invention relates to the technical field of circuit board production, and specifically provides a method for producing a multilayer circuit board with high line alignment accuracy. Background technique [0002] As the wiring density of the packaging substrate becomes more and more refined, its design requires higher and higher alignment accuracy between connected layers. At present, the design of some high-end sensor products has reached ≤20μm. [0003] However, because the existing packaging substrate is limited by the existing manufacturing process and cannot continue to be adjusted down, it is mainly limited by the quality of the drill hole shape, which makes it difficult to achieve alignment accuracy ≤ 20 μm between connected layers. [0004] In view of this, the present invention is proposed. Contents of the invention [0005] In order to overcome the above defects, the present invention provides a method for manufacturing a multi-layer ci...
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IPC IPC(8): H05K3/46
CPCH05K3/4652H05K3/4679
Inventor 马洪伟姜寿福宗芯如
Owner JIANGSU PROVISION ELECTRONICS CO LTD