Method for thinning solid-body layers provided with components

Abstract

According to claim 1, the invention relates to a method for providing at least one solid-body layer (4). The solid-body layer (4) is separated from a solid body (1). The method according to the invention preferably has the steps of: producing a plurality of modifications (9) in the interior of the solid body (1) using laser beams in order to form a separation plane (8), compressive stresses beingproduced in the solid body (1) by the modifications (9); separating the solid-body layer (4) by separating the remaining solid body (1) and the solid-body layer (4) along the separation plane (8) formed by the modifications (9), wherein at least parts of the modifications (9) which produce the compressive stresses remain on the solid-body layer (4), and enough modifications (9) are produced that the solid-body layer (4) is separated from the solid body (1) on the basis of the modifications (9) or an external force is introduced into the solid body (1) in order to produce additional stresses inthe solid body (1), said external force being so great that the stresses cause a crack to propagate along the separation plane (8) produced by the modifications; and producing a metal layer on the surface exposed by the separation of the solid-body layer (4) from the solid body (1) in order to at least partly, preferably greatly and particularly preferably completely, compensate for a deformationof the solid-body layer (4) produced by the compressive stresses of the remaining modification parts or at least partly, preferably greatly or completely, compensate for the compressive stresses.

Description

technical field [0001] The invention according to claim 1 relates to a method for separating at least one solid layer from at least one solid or to a method for providing at least one solid layer to provide at least one solid layer, and according to claim 2 to a method with A method for producing electrical components and according to claim 15 relates to a multi-component assembly. Background technique [0002] A series of components of the semiconductor industry are required on thinned solid layers or substrates. However, since thin substrates are difficult to handle in conventional processes, and wafers can only be produced to a certain thickness by means of conventional wire sawing, the most common way to manufacture such components on thin substrates is after processing The substrate is then ground or thinned on its back side. [0003] Here, after final processing of conventional wafers, the final desired substrate thickness is produced by removing excess material in g...

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However, it has been established that such fillers generally worsen the adhesion of the polymer to

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