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Micromechanical presssure sensor device and corresponding production method

一种压力传感器、微机械的技术，应用在测量流体压力、通过电磁元件测量流体压力、仪器等方向，能够解决压力传感器设备性能变差等问题，达到有效机械解耦、简单密封连接的效果

Active Publication Date: 2020-07-03
ROBERT BOSCH GMBH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, air bubbles should not be included in the gel as this degrades the performance of the pressure sensor device

Method used

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  • Micromechanical presssure sensor device and corresponding production method
  • Micromechanical presssure sensor device and corresponding production method
  • Micromechanical presssure sensor device and corresponding production method

Examples

Experimental program
Comparison scheme
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Embodiment Construction

[0025] In the figures, identical reference numbers indicate identical or functionally identical elements.

[0026] figure 1 A schematic cross-sectional illustration of a micromechanical pressure sensor device according to a first embodiment of the invention is shown.

[0027] exist figure 1 , the reference SE indicates a sensor substrate with a front side VS and a back side RS. The pressure sensor arrangement SB is suspended in the substrate. In the present embodiment, the suspension is realized by conductor tracks (not shown) in the sensor substrate SE, but may optionally or alternatively be realized by webs of the substrate material, for example silicon.

[0028] A first chamber K1 is arranged in the sensor substrate SE above the pressure sensor arrangement SB, which first chamber emerges through a plurality of access openings Z toward the front side VS.

[0029] The pressure sensor arrangement SB suspended in the sensor substrate SE is surrounded by a plurality of stres...

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PUM

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Abstract

The invention relates to a micromechanical pressure sensor device, and to a corresponding production method. The micromechanical pressure sensor device is provided with a sensor substrate (SE) havinga front side (VS) and a back side (RS), a pressure sensor apparatus (SB) suspended in the sensor substrate (SE), wherein there is a first cavern (K1) above the pressure sensor apparatus (SB), which isopen to the front side (VS) via one or more access openings (Z), one or more stress relief trenches (T1, T2), which laterally enclose the pressure sensor apparatus (SB) and form a fluid connection from the back side (RS) to the first cavern (K1), and a circuit substrate (AS), to which the back side (RS) of the sensor substrate (SE) is bonded, wherein a second cavern (K2) is formed below the pressure sensor apparatus (SB) in the circuit substrate (AS) and is fluidically connected to the stress relief trenches (T1, T2), and wherein at least one channel (ST) is provided in a periphery of the pressure sensor apparatus (SB), which is fluidically connected to the second cavern (K2) and is open to the outside.

Description

technical field [0001] The invention relates to a micromechanical pressure sensor device and a corresponding manufacturing method. Background technique [0002] Although any micromechanical pressure sensor device can be used, the invention and the problem based on the invention are explained in terms of a silicon-based micromechanical pressure sensor device. [0003] DE 10 2014 200 512 A1 describes a micromechanical pressure sensor device and a corresponding production method. The micromechanical pressure sensor device comprises an ASIC wafer, on the front side of which a wiring arrangement with a plurality of stacked conductor track planes and insulating layers is arranged. Furthermore, the micromechanical pressure sensor arrangement comprises a MEMS wafer, in which a pressure sensor arrangement is arranged, which can be acted upon with pressure from the front side through a plurality of through-openings. Pressure sensing is achieved by means of a capacitive measuring met...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01L19/06G01L19/00B81B7/00G01L9/00G01L19/14
CPCB81B7/0048B81B2201/0264G01L9/0045G01L9/008G01L19/0038G01L19/0627G01L19/146
Inventor V·森兹A·丹嫩贝格J·佛伦茨
Owner ROBERT BOSCH GMBH
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