A kind of single crystal metal foil material and preparation method thereof
A metal foil and polycrystalline metal technology, which is applied in the field of single crystal metal material preparation, can solve problems such as difficult to achieve large-area preparation, and achieve the effect of controllable process and simple operation
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[0046] refer to figure 1 , is a preparation method of a single crystal metal foil material of the present invention, specifically, a preparation method of a single crystal metal foil material comprises the following steps:
[0047] S100: apply stress on both ends of the polycrystalline metal foil; then perform step S200;
[0048] In this embodiment, the polycrystalline metal foil is first cut into an "I" shape whose two ends are wider than the middle, and a hole is punched in the center of the two ends with a large width, and a tensioner is installed through the hole to apply a certain amount of pulling force to provide Apply a certain amount of stress, the stress size is 0-300Mpa; the specific shape can refer to figure 2 , where F1, F1' are the applied tension, 2 and 4 are holes, and 3 is the annealing target area;
[0049] Preferably, the polycrystalline metal foil has a thickness of 1-100 μm and a size of 1 mm 2 -1000mm 2 , The metal types of the polycrystalline metal ...
Embodiment 1
[0059] Cut a copper foil with a size of 10cm*5cm and a thickness of 25 microns into figure 1 For the shape shown, punch a hole in the punched area, put it into the annealing area of the quartz tube, bend it at 60 degrees with a bending radius of 3 mm, install a stress-lifting device, and then pass in hydrogen gas of 100 sccm and argon gas of 200 sccm as protective gas and The process gas is heated at a rate of 5°C / s, and kept for 60 minutes after the temperature is raised to 1050°C. During the annealing process, the stress gradually increases from 0-30Mpa, and the temperature is lowered to observe the polycrystalline annealing state, as shown in Figure 6a. A single grain is obtained in the annealing target region 3, for Figure 6a Observation of a single grain in the Figure 6b ESBD results plot in .
Embodiment 2
[0061] Cut a copper foil with a size of 10cm*8cm and a thickness of 25 microns into figure 1 For the shape shown, punch holes in the punching area, put them into the annealing area of the quartz tube, bend them at 90 degrees with a bending radius of 1mm, install the pulling device, and then pass in hydrogen gas of 200 sccm and argon gas of 400 sccm as protective gas and The temperature of the process gas is raised at a rate of 5°C / s, and the temperature is kept at 1050°C for 120 minutes. During the heating and annealing process, the stress gradually increases between 0-40Mpa, and the temperature is lowered to finally get Figure 7a As shown in the experimental diagram, observe the grain state on the surface of copper foil after annealing. Figure 7a Observation of a single grain in the annealing target region 3 in Figure 7b ESBD results plot in .
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