Extraction device and extraction method for defect pattern of detection object, and storage medium
A technology for detecting objects and extracting devices, which is applied in image analysis, image data processing, special data processing applications, etc., can solve problems such as time-consuming and difficult detection, and achieve the effect of reducing analysis time and effectively extracting and judging
Pending Publication Date: 2020-07-17
SHANGHAI INTEGRATED CIRCUIT RES & DEV CENT +1
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[0005]
However, the above-mentioned method needs to analyze and judge all the defect patterns through the design intention data. Since the number of defect patterns and the amount of data output from the inspection device are huge, there is a problem that it takes time to analyze, so that effectively It becomes difficult to detect meaningful defect patterns
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[0052] The specific embodiment of the present invention will be further described in detail below in conjunction with the accompanying drawings.
[0053] In an embodiment of the invention, see figure 2 , figure 2 Shown is a schematic structural diagram of a preferred embodiment of the detection object defect pattern extraction device of the present invention. As shown in the figure, the extraction device includes a defect detection result reading module, a defect detection result analysis module, a layout data reading module, a layout data analysis module, a rule base analysis module, a physical simulation execution analysis module, and a pattern matching execution analysis module. The module and the data processing and analyzing module, the picture display control module connected between the data processing and analyzing module and the display, and the keyboard control module connected between the keyboards of the data processing and analyzing module.
[0054] In the emb...
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The invention relates to an extraction device and an extraction method for a defect pattern of a detection object, and a storage medium. The extraction device comprises a defect detection result reading module, defect detection result analysis module, layout data reading module, the system comprises a layout data analysis module, a rule base analysis module, a physical simulation execution analysis module, a pattern matching execution analysis module, a data processing analysis module, a picture display control module connected between the data processing analysis module and a display, and a keyboard control module connected between keyboards of the data processing analysis module. According to the method, all inspection candidate patterns are extracted in advance by utilizing analysis ofdesign layout data and a simulation result of a semiconductor manufacturing process; according to the present invention, it is possible to determine the degree of importance of inspection by comparingthe detected defect pattern with a defect pattern output from an inspection device without determining whether or not all defect patterns are nuisance defects, and it is possible to drastically reduce the analysis time for finding a defect pattern having a high degree of importance that needs to be inspected.
Description
technical field [0001] The present invention relates to the technical field of semiconductor manufacturing, and more specifically, to an extraction device, extraction method and storage medium for a detection object defect pattern. Background technique [0002] During the wafer fabrication process, various physical components of transistors, diodes, capacitors, resistors, and metal layers are formed in fine patterns on or in the surface layers of the wafer. When performing defect inspection on micro-patterns on semiconductor wafers or masks, the industry usually adopts two methods: implementing comprehensive inspection and narrowing the inspection range. The comprehensive inspection method is to inspect all the defect patterns output from the inspection device, but there is a problem that the inspection time is huge. The method of narrowing the detection range is to detect the selected defect pattern, and not to detect the defect pattern that is not selected. Although the ...
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Login to View More IPC IPC(8): G06T7/00G06F30/392
CPCG06T7/0004Y02P90/30
Inventor 小林尚弘李铭赵宇航卢意飞黄寅
Owner SHANGHAI INTEGRATED CIRCUIT RES & DEV CENT