Polyimide combined copper column element

Abstract

The invention discloses a polyimide combined copper column element and belongs to the technical field of wafer production. The element comprises a copper column, a tungsten column, a wafer substrate and a lead frame. The tungsten column is fixedly connected to the wafer substrate. The wafer substrate is fixedly connected with a silicon nitride layer. The silicon nitride layer is fixedly connectedwith a polyimide layer. The copper column is fixedly connected to the tungsten column. A side surface and a top surface of the copper column are coated with noble metal shell coating layers. The leadframe is welded on the noble metal shell coating layers, and a welding contact surface of the lead frame and the noble metal shell coating layers forms a co-fusion alloy contact layer so that problemsof poor process heat dissipation performance of a lead welding copper pad surface and poor contact point reliability when the lead welding copper pad surface is used in severe environment occasions in the prior art are solved.

Description

technical field [0001] The invention relates to the technical field, in particular to a polyimide-bonded copper column component. Background technique [0002] The development of electronic components tends to be smaller, thinner, lighter, and with better performance characteristics. Heat dissipation and contact reliability are very important, especially for high-current, high-voltage, and high-frequency power components. The current chip grain production process produces a copper / aluminum pad, and after the grain is cut, the lead frame (Lead Frame) is welded with gold, aluminum, or copper wires for packaging. On the conductive pad surface of the grain, silicon nitride is used as the passivation layer, and wires are used to weld between the lead frames. However, because the pad surface is embedded in the grain dielectric layer, the heat dissipation of the wire welding process on the copper pad surface is poor, and When used in harsh environments for a long time, it is easy ...

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Problems solved by technology

[0003] Aiming at the deficiencies of the prior art, the object of the present invention is to provide a polyimide combined with copper column element, which solves the problem of poor heat dissipation in the process of welding the copper pad surface of the wire in the prior art and the use of upper contact points in harsh environments. The problem of poor reliability

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