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Wafer dicing machine for semiconductor processing

A dicing machine, semiconductor technology, applied in metal processing equipment, manufacturing tools, grinding machines, etc.

Active Publication Date: 2021-08-20
湖南艾凯瑞斯智能科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The present invention provides a wafer dicing machine for semiconductor processing, which has the advantages of clearing slag on the fan surface, avoiding secondary division friction, and overall cooling, and solves the problems mentioned in the above-mentioned background technology

Method used

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  • Wafer dicing machine for semiconductor processing
  • Wafer dicing machine for semiconductor processing
  • Wafer dicing machine for semiconductor processing

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Embodiment Construction

[0024] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0025] see Figure 1-7, a wafer dicing machine for semiconductor processing, comprising a sucker workbench 1, a wafer 2 is arranged on the top surface of the sucker workbench 1, a cutting mechanism 3 is arranged on the top surface of the wafer 2, and a front surface of the cutting mechanism 3 is fixedly installed with Grinding wheel 4, the top of grinding wheel 4 is fixedly sleeved with main cooling box 5, the two sides of main cooling box 5 are fixedly instal...

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Abstract

The invention relates to the technical field of semiconductor processing, and discloses a semiconductor processing wafer dicing machine, which comprises a suction cup worktable, the top surface of the suction cup worktable is provided with a wafer, and the top surface of the wafer is provided with a cutting mechanism , the front of the cutting mechanism is fixedly installed with a grinding wheel, the top of the grinding wheel is fixedly sleeved with a main cooling box, the two sides of the main cooling box are fixedly installed on the front of the top of the cutting mechanism, and the inner side of the top of the main cooling box The fixed socket is connected with a curved nozzle. The invention transports the cooling liquid inside the cooling liquid tank to the cleaning channel composed of the first transition pipe, the regulating pipe, the second transition pipe and the pressure nozzle through the second small pumping mechanism, and then passes through the bottom of the pressure nozzle. The port is ejected and moves together with the cutting and dividing direction of the grinding wheel to clean the silicon powder cut by the grinding wheel in time to ensure the cleanliness of the processing surface and improve the division quality of the wafer by the grinding wheel under the action of the cutting mechanism.

Description

technical field [0001] The invention relates to the technical field of semiconductor processing, in particular to a wafer dicing machine for semiconductor processing. Background technique [0002] Scribing machines include grinding wheel scribing machines and laser scribing machines. At present, the grinding wheel scribing machine is the most cost-effective and widely used. The grinding wheel scribing machine integrates water, gas, electricity, air static pressure high-speed spindle, precision mechanical transmission, and sensors. Precision numerical control equipment with automatic control technology is mainly used for scribing and cutting of materials such as silicon integrated circuits and light-emitting diodes. There are still some problems that need to be improved during the slicing process. First, the grinding wheel dicing machine lacks a cooling and cleaning device to clean the silicon powder generated in the wafer dividing groove and the wafer surface. The circular ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24B27/06B24B55/06B24B55/02
CPCB24B27/06B24B55/02B24B55/06
Inventor 杜志运喻紫微胡天胡夏妹陈兖清
Owner 湖南艾凯瑞斯智能科技有限公司
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