Corrosion protected mold compound

A technology of molding compounds and polymers, which is applied in the direction of circuits, electrical solid devices, semiconductor devices, etc., can solve the problems of reliability, stickiness of tackifiers and molding tools, etc., so as to increase reliability, prevent peeling or Separates, simplifies the effect of molding compound

Pending Publication Date: 2020-07-31
INFINEON TECH AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the presence of release agents can cause lifetime reliability issues
On the other hand, the presence of tackifiers as part of the molding compound can cause problems with sticking to the molding tool

Method used

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  • Corrosion protected mold compound
  • Corrosion protected mold compound
  • Corrosion protected mold compound

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0063] The illustrations in the figures are schematic and not to scale.

[0064] Before describing the exemplary embodiments in more detail with reference to the accompanying drawings, some general considerations will be summarized upon which the exemplary embodiments will be developed.

[0065] Advantageous components of molding compounds according to exemplary embodiments are disclosed in Table 1 below:

[0066]

[0067]

[0068] Table 1: Components of the molding compound according to an exemplary embodiment (all weight percentages in Table 1 are based on the total weight of the molding compound)

[0069] The implementation of the above material systems as molding compounds is easily carried out by adjusting the mixture according to the requirements of a particular application.

[0070] According to an exemplary embodiment, a molding compound is provided that includes a polymer resin, a curing agent, a filler, a catalyst, and a free tackifier. The free adhesion prom...

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Abstract

The invention discloses a mold compound (106). The invention relates to a mold compound (106) comprising the following components: a matrix (200) composed of a polymer resin (202), a free tackifier (204) for promoting adhesion of the mold compound (106), a curing agent (206) for curing the polymer resin (202), and a catalyst (214) for catalyzing the formation of the mold compound (106), the free tackifier (204) is less than 0.1 weight percent based on the total weight of the molding compound (106); and a filler (208).

Description

technical field [0001] Embodiments relate generally to molding compounds, methods of making molding compounds, methods of using, and electronic components. Background technique [0002] A conventional package may include an electronic chip mounted on a chip carrier such as a lead frame, may be electrically connected by bond wires extending from the chip to the chip carrier, and may be molded using a molding compound. [0003] Conventional molding compounds must fulfill two conflicting tasks: On the one hand, they should adhere to the packaged device over the lifetime of the device. At the same time, they should not stick to the molding tool during production. [0004] Conventional molding compounds can use both tackifiers (for adhesion to the device) and mold release agents (to avoid sticking in the molding tool) in an attempt to meet both requirements at the same time. However, the presence of release agents can cause lifetime reliability issues. On the other hand, the p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08K3/22C08K3/38C08K5/3445C08K5/3472C08K5/378C08K5/5425C08K5/5435C08K5/544C08K7/18C08K13/02C08K13/04H01L23/29
CPCC08K13/04C08K7/18C08K13/02C08K3/22C08K3/38C08K5/3445C08K5/544C08K5/5435C08K5/5425C08K5/3472C08K5/378H01L23/291H01L23/296C08K2003/2227C08K2003/385C08K2201/014C08L2203/206C08L63/00H01L23/3107H01L23/295H01L23/564H01L2924/181H01L2224/48247H01L2224/73265H01L2224/48091C08G59/68C08K5/0008C08K3/013H01L2224/32245H01L2924/00012H01L2924/00014C08K5/0025C08K5/37
Inventor A·罗特E·里德尔S·施瓦布
Owner INFINEON TECH AG
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