Fabrication method of fine circuit substrate based on semi-additive method

Abstract

The invention discloses a method for manufacturing a fine circuit substrate based on a semi-additive method, comprising the following steps: plating a plurality of first copper pillars on both surfaces of a double-sided copper-clad substrate to obtain a first substrate; The first insulating layer is stacked on top of the first insulating layer, and the second copper foil is plated on the surface of the two first insulating layers to obtain the second substrate; the circuit is made on the second substrate and electroplated to obtain the third substrate; plating a plurality of second copper pillars to obtain a fourth substrate; laminating a second insulating layer on both sides of the fourth substrate, and plating a third copper foil on the surfaces of the two second insulating layers to obtain a fifth substrate; Divide the fifth substrate to obtain two processed boards containing three layers of copper foil; make circuits on the surface of the first copper foil and the third copper foil of the processed board, and then carry out conventional follow-up processes to obtain fine lines substrate. The manufacturing method of the fine circuit substrate is simple and easy to operate, and realizes the fine circuit design requirements of reducing the overall thickness of the substrate and increasing circuit density.

Description

technical field [0001] The invention relates to the technical field of circuit board fabrication, and in particular provides a fabrication method of a fine circuit substrate based on a semi-additive method. Background technique [0002] Judging from the development trend of smart devices in the past few decades, smart devices have evolved from mainframes to desktops, then laptops, and finally to today's smart phones, and devices are gradually developing towards miniaturization. The limited space of smart devices is becoming more and more difficult to carry a large number of components. The market urgently needs substrates with miniaturized, thin, and high-density circuits to ensure that more components can be installed on the premise of small smart devices. Implement more diverse functions. [0003] At present, the substrate mainly adopts the etching process to make lines on the copper foil. The copper foils of each layer are isolated by a prepreg, and the layers are connec...

AI Technical Summary

Problems solved by technology

However, this process has the following problems: ①The prepreg commonly used in the industry is affected by the thickness of the glass fiber cloth, and its thickness cannot be thinner after reaching a certain level; ②When the whole board is electroplated, in order to ensure the conductivity of the via hole, There are certain requirements for the thickness of the hole copper, that is, the copper to be electroplated has a certain thickness, and then the base copper thickness of the substrate is added, so that the surface copper has a certain thickness as a whole, and when etching fine lines , but also prone to dirty etching, resulting in short circuits

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