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Semiconductor process equipment and method capable of real-time detection of mechanical microparticles

A process equipment, real-time detection technology, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve problems such as not ensuring the best state of equipment

Active Publication Date: 2020-10-23
BETONE TECH SHANGHAI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the environment in the semiconductor manufacturing plant is dynamically changing, and regular maintenance operations cannot ensure that the equipment is in the best condition in real time. The risk of particle contamination is minimized

Method used

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  • Semiconductor process equipment and method capable of real-time detection of mechanical microparticles
  • Semiconductor process equipment and method capable of real-time detection of mechanical microparticles
  • Semiconductor process equipment and method capable of real-time detection of mechanical microparticles

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Experimental program
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Effect test

Embodiment 1

[0030] Such as figure 1As shown, the present invention provides a semiconductor process equipment that can detect mechanical microparticles in real time, and the semiconductor process equipment includes a transfer chamber 11, a transfer chamber 12, a process chamber 13, a first robot arm 14, and a second robot arm 15. Gas supply module 16, exhaust module 17, control module, first pressure gauge 19, second pressure gauge 20, optical detection module 21 and signal processing module 22; one end of the transfer chamber 11 is connected to the wafer loading platform 23 connected, the other end is connected to the transfer chamber 12, and the end of the transfer chamber 12 not connected to the transfer chamber 11 is connected to the process chamber 13; the wafer loading table 23 A stage for placing a wafer box 24 is arranged on the top, and the wafer box 24 is used for loading wafers; The wafer is transferred between the transfer chamber 11; the second robot arm 15 is located in the...

Embodiment 2

[0044] Such as Figure 6 As shown, the present invention also provides semiconductor process equipment with another structure. The main difference between the semiconductor process equipment of this embodiment and Embodiment 1 is that in Embodiment 1, the exhaust pipeline 18 is a single pipeline, and the optical detection module 21 is directly connected to the exhaust pipeline 18. This structure The advantage is that the equipment structure is simple, but the problem is that the diameter of the exhaust pipeline 18 is usually relatively large, which does not match the specifications of the inlet end of the optical detection module 21 and the detection chamber. If the exhaust pipeline is reduced 18 will affect the normal exhaust of the equipment, so this problem is improved in this embodiment. Specifically, in this embodiment, the exhaust pipe 18 includes a main pipe 181 and a branch 182, the diameter of the branch 182 is smaller than the diameter of the main pipe 181 (for exam...

Embodiment 3

[0046] Such as Figure 7 As shown, the present invention provides semiconductor process equipment with another structure. The difference between the semiconductor process equipment in this embodiment and the first embodiment is that in the first embodiment, the transfer chamber 11 and the transfer chamber 12 are connected to The same vacuum pump 29, correspondingly, there is only one optical detection module 21; and in this embodiment, the exhaust module 17 includes a first exhaust module 171 and a second exhaust module 172, the first exhaust module 171 The module 171 is connected to the transfer chamber 11 and is equipped with the independent first vacuum pump 291, and the second exhaust module 172 is connected to the transfer chamber 12 and is equipped with the independent second vacuum pump. 292; the optical detection module 21 includes a first optical detection module 211 and a second optical detection module 212, and the first optical detection module 211 is connected to ...

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PUM

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Abstract

The invention provides a semiconductor process equipment and method capable of detecting mechanical microparticles in real time. The equipment includes a transfer chamber, a transfer chamber, a process chamber, a first robot arm, a second robot arm, a gas supply module, an exhaust module, a control module, a first pressure gauge, a second pressure gauge, an optical detection module and a signal Processing module; one end of the transfer chamber is connected to the wafer loading table, and the other end is connected to the transfer chamber; the first robotic arm is located in the wafer loading table, and the second robotic arm is located in the transfer chamber; the wafer loading table and the transfer chamber A first valve is set between the chambers, a second valve is set between the transfer chamber and the transfer chamber, a third valve is set between the transfer chamber and the process chamber, the control module is connected with the first valve and the second valve and the third valve; the optical detection module is connected with the exhaust pipeline; the signal processing module is connected with the control module, the pressure gauge and the optical detection module. The invention helps to improve the production yield.

Description

technical field [0001] The invention relates to the field of integrated circuit manufacturing, in particular to an integrated circuit manufacturing equipment, in particular to a semiconductor process equipment and method capable of detecting mechanical microparticles in real time. Background technique [0002] During the production process of semiconductor processes such as chemical vapor deposition, some tiny particulate matter often falls on the surface of the wafer. These particulate matter have different shapes, and the characteristic size is generally between micron level and tens of nanometers, which are collectively referred to as micro-particles (particle) in the present invention. [0003] In the production and manufacture of integrated circuit chips, microparticles are very harmful, so there are strict regulations on the size and quantity of microparticles on each wafer. With the shrinking of the feature size of the device on the integrated circuit chip and the in...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67
CPCH01L21/67242H01L21/67253
Inventor 金小亮宋维聪周云
Owner BETONE TECH SHANGHAI