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Method for preparing solder balls with uniform ball diameter and high degree of sphericity

A sphericity and tin ball technology, applied in the field of tin ball preparation, can solve the problems of general sphericity, waste of resources, increased production cost, etc., and achieve the effect of meeting packaging manufacturing needs, low production site requirements, and low tower equipment height.

Inactive Publication Date: 2020-08-18
太极半导体(苏州)有限公司
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  • Abstract
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The ball diameter of the solder balls obtained by the conventional technology is not uniform, and the sphericity is average; this method requires mass production first, and then subsequent screening to obtain solder balls that meet the customer's ball diameter and roundness; the obtained solder balls have a low yield rate and production High cost and serious waste of resources
[0004] Moreover, the conventional technology is that the pressure nozzle produces molten tin droplets, falls freely, and is cooled and solidified at room temperature; the cooling and solidification time at room temperature is long, and the required falling distance is large; therefore, the required tower equipment is high, and the production cost is greatly increased. The venue also has high requirements

Method used

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  • Method for preparing solder balls with uniform ball diameter and high degree of sphericity
  • Method for preparing solder balls with uniform ball diameter and high degree of sphericity

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Embodiment Construction

[0017] The present invention is described below in conjunction with accompanying drawing.

[0018] A method for preparing tin balls with uniform ball diameter and good sphericity according to the present invention comprises the following steps:

[0019] ① Preparation of precursor solution: Weigh 96.5~96.8g of tin ingot, 3g of silver particles, and 0.2~0.5g of copper particles, put them into a sealed quartz crucible, place them in a muffle furnace, and heat them at a high temperature of 1100 degrees for half an hour or so, until it is completely melted; cool down the completely melted alloy solution to 260 degrees, and then transfer it to a high-temperature-resistant autoclave;

[0020] ②Microfluidic spray freeze drying: first set the frequency of the ultrasonic oscilloscope to 6~20KHZ and the amplitude to 0~20, start the compressor to circulate absolute ethanol, and wait until the temperature drops to zero; set the flow rate of the precursor liquid to 1~10m / s and the resistanc...

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Abstract

The invention discloses a method for preparing solder balls with uniform ball diameter and high degree of sphericity. The method comprises the following steps of preparation of precursor solutions, microfluidic spray freeze drying and physical-chemical property analysis. According to the method, by adopting a microfluidic control technology, the solder balls with uniform ball diameter and high degree of sphericity can be prepared, and meanwhile the ball diameter and components of the solder balls are freely controllable; the method has the advantages of high yield of the prepared solder balls,production speed and efficiency, and is applicable for mass production; the packaging and manufacturing requirements can be met; according to the scheme, the periphery of a tower body is cooled through circulating ethanol, and molten tin spherical droplets are formed through microfluidic control nozzles, fall down, and are cooled and solidified within a very short time; the height of required tower equipment is low, and the production cost is reduced greatly; and meanwhile, the requirements for a production site are low.

Description

technical field [0001] The invention relates to a method for preparing tin balls with uniform ball diameter and good sphericity. Background technique [0002] The vast majority of existing spray preparation solder balls use conventional pressure nozzles, and the size of the solder balls is controlled by the nozzle diameter; the molten tin droplets produced by the pressure nozzles fall freely and are cooled and solidified at room temperature. [0003] The ball diameter of the solder balls obtained by the conventional technology is not uniform, and the sphericity is average; this method requires mass production first, and then subsequent screening to obtain solder balls that meet the customer's ball diameter and roundness; the obtained solder balls have a low yield rate and production High cost and serious waste of resources. [0004] Moreover, the conventional technology is that the pressure nozzle produces molten tin droplets, falls freely, and is cooled and solidified at r...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F9/08C22C13/00
CPCB22F9/082C22C13/00B22F2009/0892B22F2009/0864
Inventor 汪婷阳芳芳张军军陆海琴
Owner 太极半导体(苏州)有限公司
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