Wafer defect detection equipment

A defect detection and wafer technology, applied in the direction of optical defect/defect, image data processing, instrument, etc., can solve the problems of low detection efficiency, low output per unit time, data processing lag, etc., and the time to reach is reduced and reduced Volume, efficiency-enhancing effect

Pending Publication Date: 2020-08-18
上海果纳半导体技术有限公司
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  • Abstract
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Problems solved by technology

[0004] Existing post-development inspections are carried out through detection equipment, specifically through optical magnifying glass scanning on the detection equipment. The existing detection and scanning methods have low detection efficiency, low output per unit time, an

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  • Wafer defect detection equipment
  • Wafer defect detection equipment

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Example Embodiment

[0031] The present invention provides a wafer defect inspection equipment, which includes: a wafer carrier for fixing a wafer to be inspected; an image acquisition module, the image acquisition module includes a camera array, and the image acquisition module takes a single shot through the camera array Obtain an inspection image corresponding to the entire surface of the wafer to be inspected; a defect judgment module, which determines whether there are defects on the surface of the wafer to be inspected according to the inspection image obtained by the image acquisition module. The image acquisition module obtains the inspection image corresponding to the entire surface of the wafer to be inspected through the camera array at a time, so the wafer carrier does not need to perform scanning movement (moving in the horizontal direction) when acquiring the inspection image, and the application The wafer carrier only needs to move in a small range or a small distance in the vertical ...

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Abstract

The invention discloses wafer defect detection equipment, which comprises a wafer carrying platform which is used for fixing a to-be-detected wafer; the image acquisition module comprises a camera array, and the image acquisition module obtains a detection image corresponding to the whole surface of the to-be-detected wafer through one-time shooting of the camera array; and the defect judging module is used for judging whether the surface of the wafer to be detected has defects or not according to the detection image obtained by the image obtaining module. According to the wafer defect detection equipment, the defect detection efficiency is improved; the size occupied by the wafer defect detection equipment is reduced; the power consumption is reduced; and the cost is reduced.

Description

technical field [0001] The invention relates to the field of wafer defect detection, in particular to a high-speed wafer detection device. Background technique [0002] With the rapid development of semiconductor manufacturing technology, in order to achieve faster computing speed, larger storage capacity and more functions of semiconductor devices, semiconductor chips are developing towards higher integration; and the higher the integration of semiconductor chips, the The critical dimension (CD, Critical Dimension) of the semiconductor device is smaller. [0003] Photolithography is the most important process in semiconductor integrated production. Multi-layer processes are required in the production of integrated circuits, and each layer must be accurately aligned. After the development process is completed, the chip must be inspected after development (After Develop Inspection, ADI). The post-development inspection can find errors in the photolithography process and corr...

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Application Information

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IPC IPC(8): G06T7/00G01N21/88
CPCG06T7/0002G06T7/0004G01N21/88
Inventor 叶莹毕迪
Owner 上海果纳半导体技术有限公司
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