LED chip pad printing device capable of customizing arrangement scheme

A technology of LED chips and pad printing devices, which is applied in the direction of electrical components, semiconductor/solid-state device manufacturing, and circuits. Low, ingenious effect of the overall structure

Pending Publication Date: 2020-08-28
XIAMEN MINGDA TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the small size and huge quantity of micro-LED chips, the existing automatic transfer devices use vacuum adsorption needles to directly absorb and transfer a single LED chip to the drive circuit board for direct bond

Method used

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  • LED chip pad printing device capable of customizing arrangement scheme
  • LED chip pad printing device capable of customizing arrangement scheme
  • LED chip pad printing device capable of customizing arrangement scheme

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0038] Example 1

[0039] Please refer to Figure 1 to Figure 2 In the embodiment, an LED chip pad printing device 100 with a customizable arrangement scheme includes a pad printing platform 1 and an address adsorption control device 2; the pad printing platform 1 is provided with an initial fixed station and a target fixed station, The initial fixed station is provided with an LED chip carrier 11, and the target fixed station is provided with a target carrier 12; the addressing and adsorption control device 2 includes a suction mechanism 21, a CCD optical positioning and centering device, and a wafer Scanning block coordinate positioning system, the addressing adsorption control device 2 can realize the transfer of the LED chips on the LED chip carrier 11 according to the required arrangement to the Target vehicle 12.

[0040] The LED chip carrier 11 is customized, that is, the size and shape of the LED chip carrier 11 can be customized according to customer requirements, and can...

Example Embodiment

[0048] Example 2

[0049] Please refer to image 3 , Figure 4 with Figure 5 The difference between embodiment 2 and embodiment 1 is that the adsorption mechanism 21 includes a magnetic conductor array template 221 and a conductive coil plate 222. The conductive coil plate 222 is evenly arranged with adsorption holes according to the chip unit pitch. Conductive coils are arranged in the holes, and the conductive coils in the adsorption holes are connected in series. The magnetic conductor array template 221 is arranged with a plurality of magnetic conductors 2121 in a desired arrangement. The conductive coil plate 222 can be lifted Above the LED chip carrier 11 and the suction holes and the LED chips are arranged in one-to-one correspondence, the magnetic conductor array template 221 can be vertically arranged above the conductive coil plate 222, and the magnetic conductor 2121 and the suction holes Corresponding settings.

[0050] Specifically, a threaded groove is provided on t...

Example Embodiment

[0053] Example 3

[0054] Please refer to Image 6 The difference between embodiment 3 and embodiment 2 is that the adsorption mechanism 21 includes a magnetic conductor array template 221 and a conductive coil plate 222. The conductive coil plate 222 is evenly arranged with a number of adsorption holes according to the chip unit pitch. Conductive coils are arranged on the outer side wall of the conductive coil plate 222, the magnetic conductor array template 221 is arranged with a number of magnetic conductors 2121 in a required array, and the conductive coil plate 222 can be raised and lowered above the LED chip carrier 11 Moreover, the adsorption holes and the LED chips are arranged in one-to-one correspondence, the magnetic conductor array template 221 can be raised and lowered above the conductive coil plate 222 and the magnetic conductor 2121 is arranged corresponding to the adsorption holes.

[0055] Specifically, the conductive coil plate 222 is provided with a threaded gro...

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PUM

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Abstract

The invention provides an LED chip pad printing device capable of customizing an arrangement scheme. The LED chip pad printing device comprises a pad printing platform and an addressing adsorption control device. An initial fixing station and a target fixing station are arranged on the pad printing platform, an LED chip carrier is arranged on the initial fixing station, and a target carrier is arranged on the target fixing station; the addressing adsorption control device comprises an adsorption mechanism, a CCD optical positioning centering device and a wafer scanning block coordinate positioning system. And the addressing adsorption control device is used for transferring the LED chips on the LED chip carrier to the target carrier according to the required arrangement array by controlling the adsorption mechanism to be magnetized according to the required arrangement array. The LED chip pad printing device capable of customizing the arrangement scheme is feasible in function, and thebeneficial effect of customizing the pad printing scheme according to the chip arrangement requirement of the target carrier can be achieved.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a pad printing device for LED chips that can customize an arrangement scheme. Background technique [0002] Micro LED (Mini LED or Micro LED) is a drive circuit made of PCB, flexible FPC, BT and CMOS / TFT integrated circuit technology after the traditional LED structure is thinned, miniaturized and matrixed to realize the Dot addressable control and individually driven display technology. Due to the brightness, contrast, response time, viewing angle, resolution and other indicators of micro-LED technology are stronger than LCD and OLED technology, plus the advantages of self-illumination, simple structure, small size and energy saving, it has been widely accepted. focus on. [0003] After the micro-LED chips are fabricated, they need to be transferred to the driver circuit board to form an LED array, which is called Mass Transfer. Due to the small size and huge quantity ...

Claims

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Application Information

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IPC IPC(8): H01L21/67H01L21/683H01L33/00
CPCH01L21/67271H01L21/683H01L33/0095
Inventor 胡丹查选义陈鹏
Owner XIAMEN MINGDA TECH
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