Chip capacitor failure detection method and grinding and polishing method

Abstract

The application relates to a chip capacitor failure detection method and a grinding and polishing method. Among them, the chip capacitor failure detection method includes obtaining the outer surface image of the capacitor to be tested, and judging whether there is an abnormal area in the outer surface image; Obtain a microscopic image of the capacitor to be tested on the layer side; where the microscopic image is obtained after grinding and polishing on the laminated side; determine the current state of the capacitor to be tested according to the microscopic image and the preset failure image. By grinding and polishing the stacked side, the microscopic image of the internal structure of the chip capacitor is obtained, and according to the comparison of the internal structure of the chip capacitor, the difference between the internal structure of different types of chip capacitor failures and the common failure forms of the chip capacitor Analysis can quickly and effectively find the cause of the failure of the chip capacitor, avoiding greater losses to production, so that the problem points in the process of design, processing, and transportation can be found as soon as possible.

Description

technical field [0001] The present application relates to the technical field of capacitor failure detection, and in particular, to a method for detecting failure of a chip capacitor and a grinding and polishing method. Background technique [0002] In the production process of electronic components, the components will fail due to factors such as poor incoming materials from manufacturers or processing and welding. The full name of chip capacitors is: multilayer (multilayer, laminated) chip ceramic capacitors, also known as chip capacitors, which are the most widely used devices in electronic components. , new energy vehicles, industrial automation and medical fields are widely used, specifically for power supply filtering, signal filtering, signal coupling, resonance, DC blocking and other circuits. With such a large number of applications, the failure of chip capacitors occurs every year, although processing technology has been improving. [0003] During the implementat...

AI Technical Summary

Problems solved by technology

With such a huge number of applications, although the processing technology has been improving, the failure of chip capacitors occurs every year

[0003] During the implementation process, the inventors found that there are at least the following problems in the traditional technology: the traditional patch failure detection method has the problem of low efficiency

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