Automatic wafer feeding device for wafer feeding machine

Abstract

The invention belongs to the technical field of wafer loading, and provides an automatic wafer loading device for a wafer loading machine. The device comprises a rack, a material frame, a first positioning mechanism, a second positioning mechanism, a wafer overturning mechanism and a tray loading mechanical arm. The material frame is fixedly installed on the machine frame, the first positioning mechanism is installed on the material frame, a positioning table is further fixedly installed on the machine frame, and the multiple second positioning mechanisms are arranged on the positioning table.The wafer overturning mechanism is located between the material frame and the positioning table and comprises a rotary air cylinder driven by a driving device, a wafer taking plate is fixedly installed on a rotary disc of the rotary air cylinder, and a wafer suction hole is formed in one side of the end of the wafer taking plate. The tray loading mechanical arm is fixedly installed on the machineframe, a wafer taking and placing mechanism is arranged at the executing end of the tray loading mechanical arm, and the machine frame is further provided with a film shooting hole and a shooting mechanism corresponding to the film shooting hole. The feeding efficiency is greatly improved, the wafers cannot be damaged in the feeding process, and it is ensured that the wafer quality and the percent of pass are not affected in the wafer feeding process.

Description

technical field [0001] The invention relates to the technical field of wafer loading, in particular to an automatic wafer loading device for a wafer loading machine. Background technique [0002] Wafer refers to the silicon wafer used to make silicon semiconductor integrated circuits. Because of its circular shape, it is called a wafer. In the process of wafer production and processing, according to the requirements of the processing technology, ICP etching processing of the wafer is required. Before the ICP etching process, the wafers usually need to be arranged and placed in the tray. This process is called wafer loading. , so that during the etching process, the entire tray carrying the wafer is put into the plasma etching machine for etching process. [0003] The produced wafers are divided into front and back. During wafer processing, you should avoid touching the front of the wafer. Touching the front of the wafer will cause contamination or scratches on the wafer, wh...

AI Technical Summary

Problems solved by technology

[0005] Specifically, the technical problem to be solved by the present invention is to provide an automatic wafer loading device for a loading machine to solve the problem of labor-intensive, low-efficiency, and easy-to-scratch wafers manually placed in the tray. Wafers, technical issues affecting wafer quality

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