LCP copper-clad plate laminating process based on 5G high-frequency signal transmission

Abstract

The invention discloses an LCP copper-clad plate laminating process based on 5G high-frequency signal transmission. The laminating process is realized through a laminating device. The process comprises the following specific steps: step 1, placing an LCP copper-clad plate needing to be subjected to laminating processing on a feeding mechanism, adjusting the distance between the two groups of sliding support plates according to different sizes and specifications of lCP copper-clad plates processed by laminating, locking and fixing the sliding support plates through locking bolts, and placing acopper-clad plate needing to be laminated on the two groups of sliding support plates; and enabling the first motor to work to drive the driving bevel gear to rotate. The distance between the two groups of sliding support plates is adjusted according to different sizes and specifications of LCP copper-clad plates subjected to laminating processing, the sliding supporting plates are locked and fixed through the locking bolts, the copper-clad plates of different sizes and specifications can be conveyed, the application range of the device is widened, the copper-clad plates can be fed vertically,rapid feeding of the copper-clad plates is achieved, and the processing efficiency of the copper-clad plates is improved.

Description

technical field [0001] The invention relates to the technical field of circuit board processing, in particular to an LCP copper-clad laminate pressing process based on 5G high-frequency signal transmission. Background technique [0002] As an example of a substrate, copper clad laminates are widely used in the industrial production of various products such as circuit boards (PCBs). According to the different substrates used, copper clad laminates can generally be divided into rigid copper clad laminates (CCL) that are not easy to bend and flexible copper clad laminates (FCCL) that are bendable. [0003] Polyimide (PI) materials are mostly used as insulating substrates for manufacturing flexible copper clad laminates. However, due to the high hygroscopicity of the PI material, the reliability of the flexible printed circuit board (FPC) made of it is reduced under high humidity conditions, including the oxidation and peeling of the copper foil caused by the evaporation of wat...

AI Technical Summary

Problems solved by technology

For the 5G network, it shows more obvious advantages and more powerful functions in the actual application process. The demand for flexible copper clad laminates is increasing. The existing LCP copper clad laminates need to be laminated during production and processing. Processing, the current lamination processing efficiency is low, and the lamination effect on the copper clad laminate is poor, which affects the performance of the copper clad laminate

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