Memory and forming method thereof
A memory and bit line technology, applied in semiconductor devices, electrical solid state devices, semiconductor/solid state device manufacturing, etc., can solve problems affecting memory performance and abnormal appearance, so as to improve appearance accuracy, ensure appearance, and improve graphics The effect of precision
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Embodiment 2
[0152] The difference from Embodiment 1 is that in this embodiment, a third contact portion and a fourth contact portion are further provided in the peripheral area. Figure 5 It is a schematic cross-sectional view of the memory in Embodiment 2 of the present invention, such as Figure 5 As shown, the third contact portion 430 includes an insulating pillar 430a and a third electrically conductive layer 430b, and the third electrically conductive layer 430b covers the top surface of the insulating pillar 430a. And, the fourth contact portion 440 only includes insulating pillars.
[0153] Further, the fourth contact portion 440 and the third contact portion 430 are arranged alternately in sequence, and the insulating column 430a of the third contact portion 430 and the insulating column of the fourth contact portion 440 are filled with isolation Material. In this embodiment, there is a fourth contact portion 440 between the third contact portion 430 closest to the memory area ...
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