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High and low frequency compound vibration processing device and method oriented to hard and brittle material

A technology of composite vibration, hard and brittle materials, applied in the field of precision special processing, can solve the problems of workpiece surface and sub-surface damage, poor surface quality, unable to meet the processing requirements of high-quality hard and brittle material parts, etc.

Inactive Publication Date: 2020-09-15
LASER FUSION RES CENT CHINA ACAD OF ENG PHYSICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although this technology has obvious advantages in processing efficiency and complex structure forming, there are outstanding problems such as surface and sub-surface damage and poor surface quality of the workpiece, which cannot meet the processing requirements of high-quality hard and brittle material parts.

Method used

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  • High and low frequency compound vibration processing device and method oriented to hard and brittle material
  • High and low frequency compound vibration processing device and method oriented to hard and brittle material

Examples

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Embodiment Construction

[0023] The present invention will be further explained below in conjunction with the accompanying drawings.

[0024] Such as figure 1 As shown, the high-low frequency composite vibration processing device for hard and brittle materials of the present invention includes an ultrasonic vibration tool holder 3, a tool 4 mounted on the ultrasonic tool holder 3 through a driving coil 2, and the ultrasonic vibration tool holder 3 is installed on the machine tool spindle On the other hand, the transmission of ultrasonic vibration energy and signals is realized through the driving coil 2; the device also includes a low-frequency vibration platform 7 for placing the parts to be processed 5, and a waveform generator 9 connected with the low-frequency vibration platform 7 and piezoelectric ceramics Drive power 8, the low-frequency vibration platform 7 is installed on the X-direction slide 1 or Y-direction slide 6 of the machine tool.

[0025] The device of the present invention drives th...

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PUM

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Abstract

The invention provides a high and low frequency compound vibration processing device oriented to a hard and brittle material. The device comprise an ultrasonic vibration cutter handle, a cutter installed on the ultrasonic vibration cutter handle through a driving coil, a low-frequency vibration platform used for placing a part to be processed, a waveform generator and a piezoceramic driving powersupply, wherein the waveform generator and the piezoceramic driving power supply are connected with the low-frequency vibration platform. The device has the characteristic of a simple structure. The invention also provides a high and low frequency compound vibration processing method oriented to the hard and brittle material. According to the method, a relative movement way and a contact conditionof a workpiece and the cutter are improved to effectively reduce subsurface stratum damage depth and improve the surface quality of a processed part, and the processing requirements of a high-qualityhard and brittle material part can be met.

Description

technical field [0001] The invention belongs to the field of precision special processing, and in particular relates to a high-low frequency composite vibration processing device and method for hard and brittle materials. Background technique [0002] Hard and brittle materials such as ceramics, glass, and crystals have been used in space technology, energy engineering, mechanical engineering, automobile industry, petroleum, chemical industry, metallurgy, textile industry and biological industries due to their low density, heat resistance, wear resistance, and corrosion resistance. It has been widely used in medical engineering and other fields, and has become an indispensable new material in high-tech fields such as modern industry, national defense and aerospace. [0003] However, due to the particularity of hard and brittle materials, conventional machining methods are difficult to process parts. At present, the high-frequency vibration processing technology using ultras...

Claims

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Application Information

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IPC IPC(8): B23D79/00
CPCB23D79/00
Inventor 张海军谢军李国宋成伟刘世忠高林黄燕华张昭瑞刘峰喻甫军傅刚
Owner LASER FUSION RES CENT CHINA ACAD OF ENG PHYSICS
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