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Integrated circuit chip with inductance coil

A technology of inductance coils and integrated circuits, applied in circuits, inductors, electrical components, etc., can solve the problems of increased chip cost and large chip area, and achieve the effect of high integration and miniaturization

Pending Publication Date: 2020-09-15
CHENGDU SINO MICROELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, the integrated inductor on the chip will occupy a large chip area, which will increase the cost of the chip.

Method used

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  • Integrated circuit chip with inductance coil
  • Integrated circuit chip with inductance coil
  • Integrated circuit chip with inductance coil

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0017] In the present invention, the structure in which metal layers and insulating layers are overlapped alternately is called a basic structure, and the welding pads are arranged on the basic structure, which belongs to the prior art.

[0018] see figure 2 In the present invention, the inductance coil of the inductor integrated in the chip is laid out around the chip pad (PAD), so as to save the chip area.

[0019] The complete rectangle in the figure is a chip pad, which is used for interconnection of power supply, ground, and signal input and output between the chip (die) and the package pins. Gold wire bonding (bounding) is generally used between the chip pad and the package pin.

[0020] The chip pad is affected by the bonding process and so on, and usually occupies a large chip area.

[0021] The inductor of the present invention carries out layout layout around the chip pad, such as figure 2 part of the inductance coil. The two ends of the inductance coil are sig...

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PUM

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Abstract

The invention discloses an integrated circuit chip with an inductance coil, and relates to an integrated circuit technology. According to the invention, an inductance coil and a chip bonding pad are arranged on the same basic structure body, an inductance coil winding surrounds the chip bonding pad, and the chip bonding pad is located in a central area of the inductance coil winding. The integrated circuit chip has the beneficial effects that the central area of the inductance winding is fully utilized, and high integration and miniaturization of the chip are facilitated.

Description

technical field [0001] The present invention relates to integrated circuit technology. Background technique [0002] The integrated inductor on the chip is often used in the phase-locked loop (PLL) circuit using the inductor-capacitor voltage-controlled oscillator (LC VCO), and the T-coil inductor used to offset the parasitic capacitance effect of the chip pad (PAD) in the high-speed signal circuit. Inductors for inductive peaking techniques used to increase circuit bandwidth, inductors used in radio frequency circuits, etc. [0003] However, the integrated inductor on the chip will occupy a large chip area, which will increase the cost of the chip. [0004] In the prior art, the ones that are closer to this patent are: [0005] Patent 1, People's Republic of China patent application number: 201110445564.2, application publication number: CN103187926A, LC-VCO chip and its layout method, the main invention is to combine the inductor coil and the filter capacitor of the RC f...

Claims

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Application Information

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IPC IPC(8): H01L23/64H01L27/118
CPCH01L28/10H01L27/118
Inventor 湛伟马淑彬夏明刚张俐丛伟林
Owner CHENGDU SINO MICROELECTRONICS TECH CO LTD