LED chip based on graphical reflector and manufacturing method of LED chip

An LED chip and manufacturing method technology, applied in electrical components, circuits, semiconductor devices, etc., can solve the problem of low front light output rate, etc., and achieve the effect of improving light output efficiency, improving reflectivity, and facilitating production

Inactive Publication Date: 2020-09-25
YANGZHOU CHANGELIGHT
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

To solve the problem of low frontal emission rate of light in the prior art

Method used

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  • LED chip based on graphical reflector and manufacturing method of LED chip
  • LED chip based on graphical reflector and manufacturing method of LED chip
  • LED chip based on graphical reflector and manufacturing method of LED chip

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0053] Such as figure 1 As shown, a method for manufacturing an LED chip based on a patterned reflector includes the following steps:

[0054] S01. Provide a growth substrate A;

[0055] S02. Laminate an epitaxial stack 1 on the surface of the growth substrate A. The epitaxial stack 1 includes an etch stop layer, a first-type confinement layer 1-2, an active layer 1-3, and a second-type confinement layer stacked in sequence along the first direction. Confinement layers 1-4 and second-type window layers 1-5, the first direction is perpendicular to the growth substrate, and the growth substrate points to the epitaxial stack 1;

[0056] In the embodiment of the present invention, as an optional embodiment, the fabrication of the epitaxial stack further includes sequentially fabricating a buffer layer, an etch stop layer, a roughening layer, a first-type confinement layer, an active layer, The second-type confinement layer and the second-type window layer; the function of the bu...

Embodiment 2

[0095] On the basis of the above-mentioned embodiments, the embodiment of the present invention also provides an LED chip based on a patterned reflector, which is manufactured based on the manufacturing method described in Embodiment 1, and its structural diagram can be referred to figure 2 shown.

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Abstract

The invention provides an LED chip based on a graphical reflector and a manufacturing method of the LED chip. A dielectric film layer grows on the surface of a second type window layer, the dielectricfilm layer comprises a dielectric film and an adhesion layer which are sequentially stacked in the first direction, and the dielectric film layer is provided with a plurality of dielectric holes usedfor forming ohmic contact; the metal reflector is in ohmic contact with the second type window layer through the ohmic contact material in the dielectric hole; good ohmic contact between the metal reflector and the second type window layer is ensured; the adhesion layer is additionally arranged between the dielectric film and the metal reflector, so that the adhesion between the metal material ofthe metal reflector and the dielectric film is improved, the surface of one side, close to the epitaxial laminated layer, of the metal reflector is smoother, the reflection effect of the metal reflector is enhanced, and the high light extraction rate of light is realized. Meanwhile, patterning of the metal reflector can be achieved, so that the reflection path of light is changed, and the light emitting efficiency of the LED chip is improved.

Description

technical field [0001] The invention relates to the field of light-emitting diodes, in particular to an LED chip based on a patterned reflector and a manufacturing method thereof. Background technique [0002] With the rapid development of LED technology and the gradual improvement of LED light efficiency, the application of LED is becoming more and more extensive. The mechanism of the LED active layer to generate light is spontaneous radiation. The light radiates randomly in all directions, so that only a small part of the light is emitted from the front of the LED chip, and a large amount of light is bound inside the LED chip after multiple reflections inside the chip. , and the light bound inside the LED chip is finally absorbed by the semiconductor material, active layer and metal electrodes, and converted into heat. Due to the influence of the LED chip package, usually only the light emitted from the front can be effectively used, while the light escaping from the bott...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/46H01L33/02H01L33/36H01L33/00
CPCH01L33/005H01L33/02H01L33/36H01L33/46
Inventor 郭凤丽徐洲王洪占吴奇隆蔡和勋
Owner YANGZHOU CHANGELIGHT
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