System and method for processing laser drilling thick glass

Abstract

The invention provides a system for processing laser drilling thick glass, and belongs to the technical field of glass processing. A laser device, a beam expander, a reflector, a dynamic focusing element, a scanning galvanometer and a telecentric focusing field lens are sequentially arranged in the light path direction. The laser provides a direct energy source, the beam expander carries out beanexpanding and angle divergence treatment on laser output by the laser device, the dynamic focusing element controls the position of a laser beam focusing point to move up and down, the scanning galvanometer controls the motion track of laser beams, and the laser beams are focused on the glass through the telecentric focusing field lens. Water cooling is further included for cooling the scanning galvanometer to guarantee the stability of the center position of the scanning galvanometer. The invention further provides a method for processing the laser drilling thick glass. Different kinds of layering treatment are adopted for the thick glass, different layers correspond to different processing parameters, the processing laser power from the glass bottom layer to the surface layer is designedto be gradually reduced layer by layer, hole drilling is carried out from bottom to top layer by layer, the processing yield and speed are greatly increased, and the processing quality is greatly improved.

Description

technical field [0001] The invention belongs to the technical field of glass processing, and in particular relates to a processing system method for laser perforated thick glass. Background technique [0002] The current traditional glass drilling process, the main drilling method is that the motor drives the diamond drill, and uses the drill bit to rotate at high speed and grind the glass surface to produce circular holes. This processing method is a contact processing method, which causes relatively large stress damage to the glass, high product defect rate, cracked edges and scratches on the surface of the drilled hole, and cannot make micro-holes at the millimeter level, and the efficiency is very low, causing environmental pollution. serious. At the same time, the drill bit needs to be replaced regularly due to wear and tear, which increases the maintenance cost of the equipment and causes a waste of funds. [0003] Although the green laser drilling process can solve ...

AI Technical Summary

Problems solved by technology

However, in thick glass processing, due to the thickness of the glass and the refractive index of the glass, when the thickness of the glass increases, the depth of focus of the laser increases rapidly due to the thickness and refractive index, which results in the power density of the laser power in the glass cutting line If the power density is not enough, the glass cannot be processed normally, or it will not move, or it will burst, or the bottom is processed normally, but the glass surface is severely overheated and burst

[0004] In view of this, there is an urgent need to study a processing method for laser drilling thick glass, not only to consider the influencing factors when laser drilling thin glass, but also to optimize and adjust the laser energy distribution by referring to the thickness of the glass, so as to overcome the existing problems of laser drilling. The problem that glass can only be processed with a thickness of less than 5mm

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