A processing system and method for laser drilling thick glass

Abstract

The invention provides a processing system for laser perforated thick glass, which belongs to the technical field of glass processing. A laser, a beam expander, a reflection mirror, a dynamic focusing element, a scanning vibrating mirror, and a telecentric focusing field mirror are sequentially arranged along the direction of the optical path; The laser provides a direct energy source. The beam expander performs beam expansion and divergence angle processing on the laser output from the laser. The dynamic focusing element controls the position of the focus of the laser beam to move up and down. The scanning galvanometer controls the trajectory of the laser beam. The telecentric focusing field lens The laser beam is focused on the glass; water cooling is also included to dissipate heat from the scanning galvanometer to ensure the stability of its center position. The present invention also provides a processing method for laser perforated thick glass. Different layers are used for thick glass. Different layers correspond to different processing parameters. The processing laser power from the bottom layer of the glass to the surface layer is designed to decrease layer by layer. Drilling holes layer by layer from bottom to top greatly improves the processing yield and speed, and greatly improves the processing quality.

Description

technical field [0001] The invention belongs to the technical field of glass processing, and in particular relates to a processing system method for laser perforated thick glass. Background technique [0002] The current traditional glass drilling process, the main drilling method is that the motor drives the diamond drill, and uses the drill bit to rotate at high speed and grind the glass surface to produce circular holes. This processing method is a contact processing method, which causes relatively large stress damage to the glass, high product defect rate, cracked edges and scratches on the surface of the drilled hole, and cannot make micro-holes at the millimeter level, and the efficiency is very low, causing environmental pollution. serious. At the same time, the drill bit needs to be replaced regularly due to wear and tear, which increases the maintenance cost of the equipment and causes a waste of funds. [0003] Although the green laser drilling process can solve ...

AI Technical Summary

Problems solved by technology

However, in thick glass processing, due to the thickness of the glass and the refractive index of the glass, when the thickness of the glass increases, the depth of focus of the laser increases rapidly due to the thickness and refractive index, which results in the power density of the laser power in the glass cutting line If the power density is not enough, the glass cannot be processed normally, or it will not move, or it will burst, or the bottom is processed normally, but the glass surface is severely overheated and burst

[0004] In view of this, there is an urgent need to study a processing method for laser drilling thick glass, not only to consider the influencing factors when laser drilling thin glass, but also to optimize and adjust the laser energy distribution by referring to the thickness of the glass, so as to overcome the existing problems of laser drilling. The problem that glass can only be processed with a thickness of less than 5mm

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