Device and method for detecting motion parameters of gluing and developing equipment

Abstract

The invention relates to a device and a method for detecting motion parameters of gluing and developing equipment. The device comprises a controller, an LK-G30 sensing head, an LK-G500 sensing head, apower supply module and an upper computer. The method comprises the steps that in one period, a plurality of set positions of a mechanical arm are set, the mechanical arm is controlled to move to a set position, in-place information of the current set position is sampled through an LK-G500 sensing head, an in-place information data set is obtained after multiple periods, and in-place informationcharacteristic values are extracted after the in-place information data set is analyzed; and a plurality of set rotating speeds of a wafer are set, the wafer is controlled to rotate to reach a set rotating speed, end jump data at different set rotating speeds is collected through an LK-G30 sensing head, and extracting an end jump characteristic value is extracted after the end jump data set is analyzed. According to the invention, the repeated positioning precision of the mechanical arm is detected, the part type selection of equipment manufacturers is guided, and the equipment precision is improved; and the end jump change rules of the wafer and a vacuum chuck at different rotating speeds are detected. The device and the method also have an important guiding effect on optimization of process parameters.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a device and method for detecting motion parameters of a glue-coating and developing device. Background technique [0002] With the development of my country's science and technology, my country's integrated circuit manufacturing industry has been greatly developed. Coating and developing equipment is one of the key equipment for integrated circuit manufacturing. Its function is to apply photoresist on the wafer, cooperate with the photolithography machine, develop after exposure, and ensure the correct transfer of the mask pattern. The manufacturing process of semiconductor integrated circuits is very complex and diverse. Each process such as gluing, developing, and etching usually faces different manufacturing processes and changes in various formula parameters. Each change will have a great impact on the final product. Large impact, which usually involves ...

AI Technical Summary

Problems solved by technology

Among them, the repeated positioning accuracy of the manipulator will eventually affect the coaxiality between the wafer and...

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