Laser processing system and laser processing method

Abstract

The invention provides a laser processing system and a laser processing method. The laser processing system involves a base plate bearing table, a laser generation assembly, a bearing table moving assembly, a laser sensing element and a control part; the laser generation assembly is arranged on one side of the table board of the base plate bearing table and comprises a laser oscillator, a pair ofgalvanometer assemblies and a light condensing element, and the bearing table moving assembly is connected with the base plate bearing table; the laser sensing element is arranged and fixed on the outer side of the base plate bearing table, and a light beam sensing surface of the laser sensing element and the table board of the base plate bearing table are located on the same horizontal plane; andthe control part is connected with the laser generation assembly, the bearing table moving assembly and the laser sensing element, the control part utilizes the bearing table moving assembly to drivethe base plate bearing table to move so as to drive the laser sensing element to move in the maximum irradiation area of the laser generation assembly, and corrects control parameters of the galvanometer assemblies of the laser generation assembly according to a detection result of the laser sensing element. Therefore, the precision of irradiation positions of laser beams of the laser processingsystem is improved.

Description

technical field [0001] The invention relates to the technical field of laser processing, in particular to a laser processing system and a laser processing method. Background technique [0002] In the semiconductor manufacturing process or display manufacturing process, laser processing systems are generally used for micro-engraving of internal circuits. With the miniaturization of semiconductor products and display products, the internal circuits are becoming more sophisticated. The position accuracy requirements are getting higher and higher. Usually, the laser processing system is generally equipped with a laser head, which is installed on a pair of linear drive units perpendicular to each other, so as to control the laser beam to be irradiated on the specified substrate to be processed, or irradiated to the processing of the processed substrate. position; or use a pair of vibrating mirrors composed of a motor and a mirror to irradiate the laser beam generated by the lase...

AI Technical Summary

Problems solved by technology

[0005] In view of the shortcomings of the prior art described above, the object of the present invention is to provide a laser processing system and a laser processing method, which are used to solve the problem that the deformation of the laser beam irradiation position of the laser processing system in the prior art will reduce the laser beam irradiation position. precision, leading to technical problems in the final formation of semiconductor products or defects in display products

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