Multi-chip 3D packaging structure and manufacturing method thereof

Abstract

The invention provides a multi-chip 3D packaging structure and a manufacturing method thereof. In the packaging structure, the first bare chip and the second bare chip arranged back to back and the conductive pillars are packaged in the plastic sealing layer, and the first bare chip includes A number of first pads, the active surface of the first die is covered with a protective layer exposing the first pad, and the second bare chip includes a number of second pads located on the active surface; the protective layer, the first pad, the conductive column There is a first rewiring layer on the first end of the first end and the front side of the plastic encapsulation layer to perform circuit layout on each first pad, and the first redistribution layer is led to the back side of the plastic encapsulation layer through conductive pillars; the active surface of the second die , the second end of the conductive column and the back of the plastic encapsulation layer have a second rewiring layer to carry out circuit layout for each second pad, the second rewiring layer is electrically connected to the first rewiring layer through the conductive column, and the second Pins are provided on the redistribution layer. The wiring of the multi-chip 3D packaging structure is more complex, the volume is smaller, and the degree of freedom is higher.

Description

technical field [0001] The invention relates to the technical field of chip packaging, in particular to a multi-chip 3D packaging structure and a manufacturing method thereof. Background technique [0002] In recent years, with the continuous development of circuit integration technology, electronic products are increasingly developing in the direction of miniaturization, intelligence, high integration, high performance and high reliability. Packaging technology not only affects the performance of the product, but also restricts the miniaturization of the product. [0003] In view of this, the present invention provides a multi-chip 3D packaging structure and a manufacturing method thereof, so as to meet the requirements of small volume, compact structure and high integration of the packaging structure. Contents of the invention [0004] The object of the present invention is to provide a multi-chip 3D packaging structure and a manufacturing method thereof, so as to meet ...

AI Technical Summary

Problems solved by technology

Packaging technology not only affects the performance of the product, but also restricts the miniaturization of the product

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