Novel structure and manufacturing method of higher-order mode absorber

A manufacturing method and a new structure technology, applied in the direction of manufacturing tools, assembly machines, metal processing equipment, etc., can solve problems such as low absorption efficiency, multiple production processes, and complex structures, and achieve high production success rate, good reliability, and strength high effect

Active Publication Date: 2020-11-06
HUADONG PHOTOELECTRIC TECHN INST OF ANHUI PROVINCE
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0002] The manufacture of the absorber usually adopts a multi-piece splicing and assembly structure, which has many manufacturing processes and a complex structure. Due to the gaps between the sheets of silicon carbide, the absorption efficiency is low.

Method used

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  • Novel structure and manufacturing method of higher-order mode absorber
  • Novel structure and manufacturing method of higher-order mode absorber
  • Novel structure and manufacturing method of higher-order mode absorber

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Embodiment Construction

[0027] Specific embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings. It should be understood that the specific embodiments described here are only used to illustrate and explain the present invention, and are not intended to limit the present invention.

[0028] In the present invention, in the absence of a contrary description, the orientation words included in the term, such as "inside and outside", only represent the orientation of the term in the normal use state, or the common name understood by those skilled in the art, and should not be viewed as a limitation of this term.

[0029] see Figure 1 to Figure 4 , the present invention provides a novel structure of a high-order mode absorber, comprising silicon carbide, an oxygen-free copper ring and a stainless steel ring in a barrel structure, and the silicon carbide, oxygen-free copper ring and stainless steel ring are sequentially sleeved and assembled fro...

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Abstract

The invention discloses a novel structure of a higher-order mode absorber. The novel structure comprises silicon carbide adopting a barrel-shaped structure, an oxygen-free copper ring and a stainlesssteel ring which are sequentially assembled from inside to outside in a sleeve manner; an annular water path channel for cooling is jointly formed in the outer wall of the oxygen-free copper ring andthe inner wall of the stainless steel ring, and besides, a solder groove and a positioning boss which are mutually matched are formed on the joint surfaces of two ends of the oxygen-free copper ring and the stainless steel ring. The novel structure is simple, small in size, easy to manufacture, high in strength, good in reliability and suitable for mass production. The invention also discloses a manufacturing structure comprising the following steps: a, feasibility demonstration of thermal assembly of the oxygen-free copper ring and the silicon carbide; b. welding of the oxygen-free copper ring and the stainless steel ring; c. installation of the absorber; d. test of the assembly tightness of the oxygen-free copper ring and the absorber; and e. water path pressure detection. The method issimple, compact in structure, high in production success rate, and short in cycle; and meanwhile, less chemicals and metal raw materials are used in production and manufacturing, so that the production risk is reduced, and the environmental protection is facilitated.

Description

technical field [0001] The invention relates to a novel structure and manufacturing method of a high-order mode absorber. Background technique [0002] The manufacture of the absorber usually adopts a multi-piece splicing and assembling structure, which has many manufacturing processes and a complex structure. Due to the gaps between the silicon carbide sheets, the absorption efficiency is low. In order to achieve the purpose of absorption, the structure size can only be increased to increase the silicon carbide area. Contents of the invention [0003] The purpose of the present invention is to provide a new structure of high-order mode absorber, which is simple in structure, small in size, easy to manufacture, high in strength and good in reliability, and suitable for mass production. [0004] Another object of the present invention is to provide a manufacturing method of a high-order mode absorber, which is simple, compact in structure, high in production success rate, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K1/008B23P21/00
CPCB23K1/008B23P21/00
Inventor 吕义巍郑君刘煜文
Owner HUADONG PHOTOELECTRIC TECHN INST OF ANHUI PROVINCE
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