Passive component nickel-tin electroplating process

An electroplating process and component technology, which is applied in the field of nickel-tin electroplating process for passive components, can solve problems such as circuit board offset, tin layer is prone to yellowing and discoloration, and current operating range is narrow, so as to ensure quality and not easy to detach Welding, to ensure the effect of repeatability and stability

Inactive Publication Date: 2020-11-06
扬州市景杨表面工程有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] ①The working range of current is narrow, and the amount of product feeding is small;
[0004] ② The solder is unstable, and often shifts after soldering to the circuit board;
[0006] ④The tin layer is prone to yellowing and discoloration after being heated;

Method used

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  • Passive component nickel-tin electroplating process
  • Passive component nickel-tin electroplating process
  • Passive component nickel-tin electroplating process

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] A nickel-tin electroplating process for passive components, comprising the steps of:

[0033] Activation steps: prepare activation solution in the activation tank, the activation solution is sulfuric acid with a concentration of 3-7%, soak the passive components in the activation solution, the activation time is 60s, after the activation is completed, the passive components are cleaned on both sides, each cleaning 30s;

[0034] Pre-soaking step: prepare a pre-soaking tank, fill the pre-soaking tank with a pre-soaking liquid, the pre-soaking liquid is a sulfuric acid solution with a concentration of 0.5%, and completely immerse the passive components in the pre-soaking tank for 30 seconds;

[0035] Nickel-plating step: prepare a nickel-plating tank, filled with basic salt, anode activator, pH buffer and nickel additive in the nickel-plating tank, the raw material concentration in the nickel-plating tank is JY-NiMu (nickel sulfate) 350g / L, JY-NiAct (nickel chloride) 30g / ...

Embodiment 2

[0048] The difference between embodiment 2 and embodiment 1 is: the concentration of the pre-dip solution in the pre-dipping step in embodiment 2, the raw material concentration in the nickel-plating step, the citric acid concentration in the pickling step and the tin-plating raw material in the tin-plating step Concentration is different from embodiment 1, and concrete parameter is as follows:

[0049] Pre-soaking step: prepare a pre-soaking tank, fill the pre-soaking tank with a pre-soaking liquid, the pre-soaking liquid is a sulfuric acid solution with a concentration of 0.75%, and completely immerse the passive components in the pre-soaking tank for 30s;

[0050] Nickel-plating step: prepare a nickel-plating tank, which is filled with basic salt, anode activator, pH buffer and nickel additive, and the raw material concentration in the nickel-plating tank is JY-NiMu (nickel sulfate) 400g / L, JY-NiAct (nickel chloride) 45g / L, boric acid 50g / L, JY-Ni003 is 30ml / L, JY-Ni004 is ...

Embodiment 3

[0055] The difference between embodiment 3 and embodiment 1 is: the concentration of the pre-dip solution in the pre-dipping step in embodiment 3, the raw material concentration in the nickel-plating step, the citric acid concentration in the pickling step and the tin-plating raw material in the tin-plating step Concentration is different from embodiment 1, and concrete parameter is as follows:

[0056] Pre-soaking step: prepare a pre-soaking tank, fill the pre-soaking tank with a pre-soaking liquid, the pre-soaking liquid is a sulfuric acid solution with a concentration of 1%, and completely immerse the passive components in the pre-soaking tank for 30s;

[0057] Nickel-plating step: prepare nickel-plating tank, be filled with base salt, anode activator, pH buffer and nickel additive in described nickel-plating tank, the raw material concentration in the nickel-plating tank is JY-NiMu (nickel sulfate) 450g / L, JY-NiAct (nickel chloride) 60g / L, boric acid 60g / L, JY-Ni003 is 50m...

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Abstract

The invention provides a novel passive component nickel-tin electroplating process, and relates to the technical field of electroplating, in particular to the field of electronic component electroplating. The novel passive component nickel-tin electroplating process comprises an activation step, a pre-impregnation step, a nickel plating step, an acid pickling step, a tin plating step and a post-treatment step. By optimizing the electroplating process, the production line, the production method and the like are optimized, a larger production range can be compatible, the resistor specification from 0402 to 2512 and the resistance value from 0R to 20M can be produced by using the same set of process, the process is suitable for large-yield production, meanwhile, the electroplating time of a single kind of plating only needs 2 hours, and the efficiency is very high.

Description

technical field [0001] The invention relates to the technical field of electroplating, in particular to a nickel-tin electroplating process for passive components. Background technique [0002] At present, with the improvement of modern technology and the rapid development of electronic products, people's lives are increasingly dependent on electronic products; and as people's demand for electronic products increases, passive elements as an important part of electronic products Most of the devices require electroplating; with the increasing quality requirements of users, the disadvantages of traditional electroplating for chip components are becoming more and more obvious: [0003] ①The working range of current is narrow, and the amount of product feeding is small; [0004] ② The solder is unstable, and often shifts after soldering to the circuit board; [0005] ③The number of double pieces is large [0006] ④The tin layer is prone to yellowing and discoloration after bei...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/30C25D3/12C25D5/12
CPCC25D3/12C25D3/30C25D5/12
Inventor 王金亮刘双成赵礼
Owner 扬州市景杨表面工程有限公司
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