Surface reactive preservative for use with solder preforms

Abstract

A composition that reacts with and preserves the metal surface of a solder preform and the preserved solder preform are described. The surface preservative composition is compatible with the physical handling of solder performs and the requirements of the soldering process. The composition comprises a carrier, a surface reactive agent, an anti-static agent and a solvent.

Description

technical field

[0001] The present invention relates to a composition capable of reacting with and protecting a solder metal surface to facilitate the handling and solderability of solder metal preforms used in the assembly of electronic components. Background technique

[0002] Electronic components have changed rapidly over the past few years. Although dual in-line (DIP) components used to be the main method of forming electrical interconnections between silicon wafers and printed circuit assemblies, surface mount components, more specifically surface mount array components such as network ball arrays (BGAS), network Land Arrays (LGAs), Chip Scale Components and various individual form factors providing electro-optical interconnection and high frequency / RF functionality are the main components in today's modern electronic instruments.

[0003] Many sub-functions such as "System in a Package" (SIP) can be accommodated in the structure of these new components, in which the ...