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Surface reactive preservative for use with solder preforms

A surface reaction, pre-forming technology, applied in the application of non-metallic protective layers, welding/cutting media/materials, welding equipment, etc., can solve the problems of uncomfortable flux viscosity, influence, low quality of assembled products, etc.

Inactive Publication Date: 2007-01-24
KAC HLDG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Thus, while a clean soldering environment may not be required using rosin flux (not applied to the preform), the flux may not be suitable for today's small geometry, high I / O electrical interconnect assemblies due to its stickiness
In addition, the "no coating" condition can mean that the handling and storage properties of the preform are adversely affected before the welding assembly operation
Consequently, that operation would result in a final assembled product that may be of lower quality than required

Method used

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Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0044] F) Preparation of Surface Reactive Protective Agent Composition

[0045] The method of preparing the protectant composition is straightforward. The solvent is placed in a mixing tank, and the solid components including the carrier composition, surface reactive agent, oxidation inhibitor, and antistatic agent (if used) are added to the mixing tank while mixing. The mixture was stirred until the solid components were dissolved. Typically, the concentration of solids in solution may range from about 0.01 to about 1.2% by weight, with about 0.07 to about 0.26% by weight being preferred.

[0046] G) Method of Applying Protective Composition

[0047] The method of applying the preservative composition to the solder preform is fairly simple, however, the process should be controlled to ensure a uniform coating of the preservative composition is formed on the solder preform so that subsequent Retains solderability during handling and shipping. Coating an appropriate amount ...

Embodiment I

[0059] A) According to the preferred reactive protective agent composition of the present invention, comprising 0.24 parts by weight of methyl stearate, 0.25 parts by weight of tin stearate and 0.51 parts by weight of stearic acid, dissolved in 78 parts by weight of isopropanol solvent (for easy to apply). The composition is prepared by dissolving the dry ingredients in isopropanol with stirring.

[0060] B) This formula contains 2.18 parts by weight of methyl stearate, 0.55 parts by weight of isophthalic acid and 1.39 parts by weight of ammonium perfluorooctanoate, dissolved in 78 parts by weight of isopropanol solvent. The composition is prepared by dissolving the dry ingredients in isopropanol with stirring.

[0061] C) This formulation contains 0 parts by weight of polylimonene, 0.5 parts by weight of azelaic acid and 0.1 parts by weight of urea, dissolved in 78 parts by weight of isopropanol solvent. The composition is prepared by dissolving the dry ingredients in isopr...

Embodiment II

[0071] The following experiments were performed to illustrate the reaction between the protectant composition of the present invention and the metal surface of a solder preform, rather than simply coating the preform.

[0072] X-ray photoelectron spectroscopy (XPS), also known as electron spectroscopy for chemical analysis (ESCA), is a powerful tool for examining solid surfaces. Quantitative information on the elemental composition of the surface and the local chemical environment of the atoms on the surface can be obtained using this detection tool. The surface is irradiated with a monochromatic X-ray beam in a vacuum chamber and penetrates the surface by up to 10 microns.

[0073] When some of the X-ray energy is absorbed, a photoelectron is emitted (photoelectron emission) leaving behind an ion with a kinetic energy approximately equal to the difference between the initial photon energy and the binding energy of the core electron of the element. This is the ionization ener...

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Abstract

A composition that reacts with and preserves the metal surface of a solder preform and the preserved solder preform are described. The surface preservative composition is compatible with the physical handling of solder performs and the requirements of the soldering process. The composition comprises a carrier, a surface reactive agent, an anti-static agent and a solvent.

Description

technical field [0001] The present invention relates to a composition capable of reacting with and protecting a solder metal surface to facilitate the handling and solderability of solder metal preforms used in the assembly of electronic components. Background technique [0002] Electronic components have changed rapidly over the past few years. Although dual in-line (DIP) components used to be the main method of forming electrical interconnections between silicon wafers and printed circuit assemblies, surface mount components, more specifically surface mount array components such as network ball arrays (BGAS), network Land Arrays (LGAs), Chip Scale Components and various individual form factors providing electro-optical interconnection and high frequency / RF functionality are the main components in today's modern electronic instruments. [0003] Many sub-functions such as "System in a Package" (SIP) can be accommodated in the structure of these new components, in which the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23F11/00C23C22/00B23K35/14B23K35/22B23K35/36B23K35/02B23K35/26C09D5/00C09K3/00C23CC23C22/02H05K3/28H05K3/34
CPCB23K35/0244C23C22/02B23K35/26B23K35/262B23K35/3612H05K3/3478H05K3/282B23K35/0222C09D5/008
Inventor G·C·穆尼
Owner KAC HLDG
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