30results about "Temporary coatings" patented technology

The present invention provides a method for stripping a composite by immersing the composite in a stripping solution, wherein the composite comprises a metal substrate and a coating applied to one or both sides of the metal substrate, wherein the coating comprises a polymeric binder, and wherein the polymeric binder comprises an aqueous copolymer. The use of a stripping solution comprising a weak base allows for a complete stripping of the composite in an efficient and extremely fast manner. Furthermore, the stripping method disclosed herein avoids complex separation procedures, contamination and corrosion of the metal substrate, and enables excellent material recovery. An application of the method for stripping an electrode of a battery is disclosed herein.

The invention relates to glazing materials comprising a substrate coated with a functional coating and with a temporary organic protective layer deposited on at least a portion of the functional coating. The protective layer is obtained by crosslinking a polymerizable composition comprising (a) (meth)acrylate compounds and (b) optionally a polymerization initiator. The temporary organic protective layer has a weight loss by thermogravimetric analysis (TGA) from 30°C to 450°C at a heating rate of 10°C / min in air of greater than 65%.

The invention relates to a masking means (14) for covering a surface region (12) of a component (10) of a fluid machine, in particular for covering a thermal spray layer, wherein the masking means (14) comprises at least one crosslinkable elastomer pre-product with a dynamic viscosity ranging between 21000 mPas and 39000 mPas at a temperature of 25±0.2°C. The invention also relates to a method for processing a component (10) of a fluid machine in which at least one surface region (12) of the component (10) is first covered by such a masking means (14) and the component (10) is then processed.

The present invention relates to a glazing material comprising a substrate coated with a functional coating and a temporary organic protective layer deposited on at least a portion of the functional coating. The protective layer is obtained by crosslinking a polymerizable composition comprising (a) a (meth) acrylate compound and (b) optionally a polymerization initiator. The temporary organic protective layer has a weight loss of greater than 65% by thermogravimetric analysis (TGA) from 30 DEG C to 450 DEG C in air at a heating rate of 10 DEG C / min.

The invention provides a method for delaminating a composite by immersing the composite into a delamination solution; wherein the composite comprises a metal substrate and a coating applied on one side or both sides of the metal substrate, wherein the coating comprises a polymeric binder; and wherein the polymeric binder comprises an aqueous copolymer. The use of delamination solution comprising a weak base allows for complete delamination of the composite in a highly efficient and extremely fast manner. Furthermore, the delamination method disclosed herein circumvents complex separation processes, contamination and corrosion of the metal substrate and enables an excellent materials recovery. An application of the method for delaminating an electrode for a battery is disclosed herein.

The present invention provides: a simple method for removing foreign substances that are formed on a substrate during a semiconductor device production process; and a composition for forming a coating film for foreign substance removal, said coating film being used in the above-described method. A composition for forming a coating film for foreign substance removal, said composition containing a polymer and a solvent and being capable of forming a coating film that dissolves in a developer liquid, wherein: the polymer is selected from among phenolic novolacs, polyhydroxystyrene derivatives and carboxylic acid-containing polymers; and the polymer is contained in an amount of 50% by mass or more relative to the total solid content in the composition.

Manufacturers, particularly manufacturers of parts for aerospace applications, may use a plating mask. Plating masks may be used to mask a metallic part during etching and plating. The present disclosure describes a temporary plating mask that may comprise a hydrocarbon resin and a styrene block copolymer. The temporary plating mask may further comprise a tackifier and other additives such as pigments, fillers, dyes, surfactants, or rheology modifiers.

Provided is a fluoropolymer containing a polymerization unit (I) based on a monomer (I) represented by general formula (I) and a polymerization unit (II) based on a monomer (II) represented by formula (II).　Formula (I): CX1X3=CX2R(-CZ1Z2-A0)m (In the formula, each of X1 and X3 independently represents F, Cl, H, or CF3; X2 represents H, F, an alkyl group, or a fluorine-containing alkyl group; A0 represents an anionic group; R represents a linking group; each of Z1 and Z2 independently represents H, F, an alkyl group, or a fluorine-containing alkyl group; and m represents an integer of 1 or larger.)　Formula (II): CHF=CHF

Provided is a fluoropolymer containing a polymerization unit (I) derived from a monomer (I) represented by the general formula (I) and a polymerization unit (II) derived from a monomer (II) represented by the formula (II):         CX1X3=CX2R(-CZ1Z2-A0)m     (I) wherein X1 and X3 are each independently F, Cl, H, or CF3; X2 is H, F, an alkyl group, or a fluorine-containing alkyl group; A0 is an anionic group; R is a linking group; Z1 and Z2 are each independently H, F, an alkyl group, or a fluorine-containing alkyl group; and m is an integer of 1 or more; and         CHF=CHF     (II)

Provided is a semiconductor chip-manufacturing protective film-forming composition capable of easily forming a semiconductor chip-manufacturing protective film to be disposed on a semiconductor chip in order to provide, by a simpler method, a semiconductor chip with a protective film capable of protecting a semiconductor chip from damage accompanying transportation when an individual semiconductor chip obtained by dicing a semiconductor substrate is transported. A semiconductor chip-manufacturing protective film-forming composition for preventing damage to a circuit surface or a back surface of a semiconductor substrate or a semiconductor chip, the semiconductor chip-manufacturing protective film-forming composition containing a polymer and a solvent, wherein the polymer is selected from a phenolic hydroxy group-containing polymer and a carboxy group-containing polymer.

The present application provides a coated steel sheet having excellent press formability. The coated steel sheet comprises a base steel sheet and a film containing an organic resin and a wax provided on at least one surface of the base steel sheet, wherein the organic resin is at least one selected from the group consisting of an acrylic resin, an epoxy resin, a polyurethane resin, a phenol resin, a vinyl acetate resin and a polyester resin, the wax is a polyolefin wax having a melting point of 100°C to 145°C and an average particle diameter of 3.0 μm or less, the proportion of the wax in the film is 5 to 70 mass%, the deviation σ' of the film adhesion amount is 0.300 or less, and the film adhesion amount μ W is 0.3 g / m 2 or more.

The present disclosure provides an article. In an embodiment, the article includes a first substrate and an adhesive layer in contact with the first substrate. The adhesive layer contains an adhesive composition. The adhesive composition includes (i) an acrylic polymer composed of polymerized units of (a) a first monomer that is a C4‐C18 alkyl acrylate and (b) a second monomer selected from acrylic acid, methacrylic acid, and a C1‐C3 alkyl acrylate optionally containing a hydroxyl group. The adhesive composition also includes (ii) at least one inorganic neutralizer, and (iii) at least one surfactant. The article includes a second substrate in contact with the adhesive layer.

The present invention is related to an actinic curable, preferably UV-curable primer composition, comprising a binder component, which contains an acrylate monomer and an acrylate oligomer or polymer, and a photoinitiator, characterized in that the acrylate monomer is acryloyl morpholine. The present invention is furthermore related to a printed product, preferably printed film or laminate (1), comprising a primer layer (3) made from the above primer composition, and to an article, preferably a flexible packing, comprising said printed product, preferably printed film or laminate (1).

The invention relates to a hot-dip coated and skin-passed steel sheet which has a steel substrate and a metal skin-passed coating which is arranged on the steel substrate and which contains an aluminum content of 0.5 to 8.0 wt.% and a magnesium content of 0.5 to 8.0 wt.% in addition to zinc and unavoidable impurities. The invention is characterized in that the metal coating has a temporary double-layered corrosion protection. The invention additionally relates to a method for producing such a steel sheet and to the use thereof in order to produce a stainless phosphatized steel sheet.

Provides an aqueous binder composition for a secondary battery electrode, comprising a copolymer and a dispersion medium, wherein the copolymer comprises a structural unit (a), a structural unit (b), and a structural unit (c). The binder composition disclosed herein has improved binding capability. In addition, battery cells comprising electrodes prepared using the binder composition disclosed herein exhibits exceptional electrochemical performance.

The present invention provides a black photosensitive composition that excels in residue suppression property when forming a pattern and can form a pattern having excellent adhesion at a smaller exposure amount, and also provides a manufacturing method of the black photosensitive composition, a cured film, a color filter, a light-shielding film, an optical element, a solid-state image capturing element, and a headlight unit. The black photosensitive composition according to the present invention includes a black pigment, a resin, a carboxylic acid anhydride, and a polymerizable compound, wherein the carboxylic acid anhydride has a molecular weight of 50-550, the content of the carboxylic acid anhydride is 0.30-10.0% by mass with respect to the total solid content of the black photosensitive composition, and the average particle size of the black pigment is 250 nm or less.

Provided is a simple method for removing foreign matter formed on a substrate in a semiconductor device manufacturing process, and a foreign matter-removing coating film-forming composition used in such a method. A composition is a foreign matter-removing coating film-forming composition that includes a polymer selected from the group consisting of phenol novolak, polyhydroxystyrene derivative, and carboxylic acid-containing polymer, and a solvent, and is capable of forming a coating film that dissolves in a developer, the composition including 50% by mass or more of the polymer relative to the entire solid content of the composition.

To provide a formulation for producing a processing aid.SOLUTION: A formulation for producing a processing aid comprises an active substance having a surface-affinitive component and an inorganic component, wherein the inorganic component comprises at least one inorganic mineral, wherein the surface-affinitive component comprises at least one alkaline-earth metal stearate and a complexing agent for forming an alkaline-earth metal complex, wherein the proportion of the inorganic component in the active substance of the formulation is 3 to 92% by weight, the proportion of the alkaline-earth metal stearate in the active substance of the formulation is 5 to 50% by weight and the proportion of the complexing agent in the active substance of the formulation is 0.1 to 3% by weight. The invention further relates to a processing aid obtainable from the preparation by dispersion in water and to a release agent. The release agent is obtained by applying a processing aid to the substrate and / or mould surface, preferably forming a coating on the surface of the substrate and / or mould.SELECTED DRAWING: Figure 1

The present invention relates to a composition for a coating protecting film comprising: an acrylic emulsion resin; a polyurethane dispersion; and a polyolefin resin, wherein the acrylic emulsion resin has a weight average molecular weight of 200,000 to 300,000 g / mol and a glass transition temperature of 50 to 80° C., and the polyurethane dispersion has a weight average molecular weight of 40,000 to 60,000 g / mol and a glass transition temperature of −70 to −20° C.

A first aspect of the invention relates to a coated substrate, the substrate comprising or consisting of glass and / or metal, said substrate having a primary coating on at least one surface; and at least one, preferably removable, layer of nanocellulose on at least a part of said at least one surface of the substrate, on top of the primary coating. In a second aspect, the invention is directed to the use of nanocellulose as, preferably removable, protective coating on a surface of a substrate having a primary coating on at least one surface. A third aspect of the invention relates to a process for protecting a substrate, a fourth aspect is directed to an aqueous mixture comprising nanocellulose, preferably obtainable or obtained by the process of the second aspect of the invention, and a fifth aspect of the invention relates to an aqueous mixture comprising nanocellulose, further comprising (or being essentially free of) at least one binder or a reaction product of at least one binder and / or at least one filler.

A steel sheet includes a base steel sheet and a film disposed on at least one side of the base steel sheet. In the steel sheet, the film includes an organic resin and a wax, the arithmetic average roughness Ra of the base steel sheet is 0.4 μm or more, the organic resin is at least one resin selected from acrylic resins, epoxy resins, urethane resins, phenolic resins, vinyl acetate resins, and polyester resins, the wax is a polyolefin wax with a melting point of 120° C. or above and 140° C. or below and an average particle size of 3.0 μm or less, the fraction of the wax in the film is 10 mass % or more, and the standard deviation σ of the film coating weight distribution per side is less than 0.9 g / m2.

Provided are: a protective film forming agent which is used for forming a protective film on a surface of a semiconductor wafer during dicing the semiconductor wafer, which is capable of forming a protective film which allows formation of a processed groove having excellent straightness by laser irradiation, and which has excellent fluorine shielding property, and a method of manufacturing a semiconductor chip using the protective film forming agent. The protective film forming agent contains a water-soluble resin (A), a light absorbing agent (B), and a solvent (S). The water-soluble resin (A) contains a water-soluble resin (A1). The water-soluble resin (A1) has an aromatic ring and a water-soluble group. The water-soluble resin (A1) preferably has a benzene ring as an aromatic monocycle.

The present invention relates to a random copolymer comprising repeat units of structure (I), (II), (III), and (IV). The invention also pertains to a neutral layer composition comprised of said random copolymer and also pertains to the use of said neutral layer composition to make a crosslinked neutral layer film on a substrate, which can enable self-assembly of a film of a block copolymer overlying said crosslinked neutral layer, wherein said block copolymer contains etch resistant and etchable block, and whose self-assembled pattern is used, through etching, to create either an array of contact holes or posts in said substrate.

A method of manufacturing a sacrificial layer may include providing a first compound including an amine compound including at least one secondary amine and a second compound including an isocyanate compound, and forming a sacrificial layer including polyurea through a polymerization reaction of the first compound and the second compound.

Disclosed is a temporary cover layer for removing and / or inactivating micro-organisms, such as viruses and / or bacteria. The cover layer comprises a body having an attachment surface for temporarily attaching the temporary cover layer to a surface of an object, wherein the body has a face comprising an active ingredient comprising copper and / or silver.

The present application provides a protective sheet, etc., which has a protective layer to be attached to a protection target surface of an electronic device having the protection target surface or a protection target surface of an electronic device joint body obtained by joining a plurality of the electronic devices, a mass reduction rate W of the protective layer after being immersed in water at 25°C for 180 seconds W is 0% by mass or more and 30% by mass or less, and a mass reduction rate W of the protective layer after being immersed in an alcohol aqueous solution at 25°C having an alcohol concentration of 55% by mass for 180 seconds S is 40% by mass or more and 100% by mass or less.

The present invention is related to an actinic curable, preferably UV-curable primer composition, comprising a binder component, which contains an acrylate monomer and an acrylate oligomer or polymer, and a photoinitiator, characterized in that the acrylate monomer is acryloyl morpholine. The present invention is furthermore related to a printed product, preferably printed film or laminate (1), comprising a primer layer (3) made from the above primer composition, and to an article, preferably a flexible packing, comprising said printed product, preferably printed film or laminate (1).

An aqueous binder composition for a secondary battery electrode includes a copolymer and a dispersion medium, wherein the copolymer includes structural unit (a), structural unit (b), and structural unit (c). The binder composition disclosed herein has improved binding ability. Furthermore, a battery including an electrode prepared using the binder composition disclosed herein exhibits excellent electrochemical performance.

The present application provides a kind of laminate, it is equipped with the release layer that can be formed by water-based coating liquid, quickly from substrate when alkali treatment, and excellent water resistance is excellent.The laminate of the present application is the laminate with release layer on substrate, the release layer includes granular carboxylic anhydride modified olefin resin and the adhesive portion comprising thermoplastic resin without acid group, the average particle size of the carboxylic anhydride modified olefin resin is 0.5-20 μm, the thickness of the adhesive portion is 0.25-20 μm, and the substantial acid value number of the release layer is 100KOHmg / m 2 The above.