To provide a
wafer edge protection film which has better
dry etching resistance than conventional
wafer edge protection films, and has an excellent film forming property even at a
wafer edge portion, which is difficult to coat.SOLUTION: A wafer edge protection film forming method is a method for forming a protection film on a
peripheral edge of a substrate, and includes the steps of:
coating the
peripheral edge of the substrate with a protection film-forming composition comprising a
solvent and an aromatic ring-containing resin (A) having an
organic group represented by the general formula (1) in the figure; and curing the applied protection film-forming composition by heat or optical
irradiation to form the protection film on the
peripheral edge of the substrate. In the formula, RA is a
hydrogen atom or a monovalent
organic group having 1 to 10 carbon atoms; and * represents a bonding site.SELECTED DRAWING: None