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Crimp-type semiconductor devices, crimp sub-modules, and elastic temperature-measuring packaging components

A technology for packaging components and sub-modules, which is applied in semiconductor devices, semiconductor/solid-state device parts, electric solid-state devices, etc. Simple, good electrical insulation effect

Active Publication Date: 2022-06-28
GLOBAL ENERGY INTERCONNECTION RES INST CO LTD +2
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] The purpose of the present invention is to provide a crimping type semiconductor device, a crimping sub-module and an elastic temperature measuring package assembly to solve the problem that the junction temperature in the prior art is difficult to measure, and the direct measurement of the temperature sensor may lead to the temperature measuring structure Damaged technical issues

Method used

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  • Crimp-type semiconductor devices, crimp sub-modules, and elastic temperature-measuring packaging components
  • Crimp-type semiconductor devices, crimp sub-modules, and elastic temperature-measuring packaging components
  • Crimp-type semiconductor devices, crimp sub-modules, and elastic temperature-measuring packaging components

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Experimental program
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Embodiment approach

[0070] A first limiting boss extends outward from the top of the probe fixing member 342 , a second limiting boss extends from the inside of the limiting sleeve 343 toward the probe fixing member 342 , and the elastic member 344 covers It is disposed on the outer side of the probe fixing member 342, and both ends of the elastic member 344 are respectively abutted with the first limiting boss and the second limiting boss. The elastic member 344 is directly sleeved on the outer side of the probe fixing member 342 , and the position of the elastic member 344 is determined by the combination of the first limiting boss protruding from the outside of the probe fixing member 342 and the second limiting boss at the bottom of the limiting sleeve 343 . It is defined so that the probe fixing member 342 can expand and contract inside the limiting sleeve 343 .

[0071] Alternatively, a limit boss can also be directly extended from the inside of the limit sleeve 343 toward the middle, or th...

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Abstract

The invention provides a crimping type semiconductor device, a crimping sub-module, and an elastic temperature measurement package assembly. Measure the temperature of the chip, which includes a temperature measuring probe for bonding with the chip component for temperature measurement, a probe holder for fixing the temperature measuring probe, and a limit sleeve set outside the probe holder, and the probe holder slides It is arranged in the limit sleeve, the top of the limit sleeve can abut against the chip component, and the limit sleeve is provided with an elastic piece. The temperature measuring probe can be directly attached to the chip component, thereby realizing contact temperature measurement, realizing intuitive and effective temperature measurement of the inner chip of the crimping type semiconductor device, meeting the temperature measurement needs of the crimping type semiconductor device, and accurate High density, wide use area, simple calculation method and good electrical insulation, it is not easy to be disturbed by the external environment.

Description

technical field [0001] The invention relates to the technical field of temperature measurement of semiconductor devices, in particular to a crimping type semiconductor device, a crimping sub-module and an elastic temperature measurement package assembly. Background technique [0002] For multi-chip large-scale parallel-connected press-contact semiconductor devices, due to the interaction of internal physical fields, the junction temperature of each chip is different, which in turn affects the performance and reliability of the device, which restricts the power level of the device. one of the important factors. Therefore, accurate measurement of the junction temperature of each chip has become one of the most concerned issues in the application of press-fit semiconductor devices. [0003] At present, the existing methods for obtaining the internal junction temperature of press-fit semiconductor devices generally include the following categories: [0004] (1) Optical method:...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01K1/14H01L23/34
CPCG01K1/14H01L23/34
Inventor 张雷陈中圆李尧圣李翠杨晓亮吴军民
Owner GLOBAL ENERGY INTERCONNECTION RES INST CO LTD
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