Packaging equipment for semiconductor production

Abstract

The invention discloses packaging equipment for semiconductor production. The packaging equipment comprises a shell, two fixed rails, four baffle plates, a motor and a packaging mechanism; the two fixed rails are connected with the front side and the rear side of an inner cavity of the shell through screws in the left-right direction correspondingly, and the left ends and the right ends of the twofixed rails extend out of the left side and the right side of the shell; the four baffles are arranged in the outer sides of the top ends of the left ends and the right ends of the two fixed rails respectively; the motor is connected with the bottom end of an inner cavity of the shell through screws in the front-back direction; and the packaging mechanism is arranged in the inner cavity of the shell. According to the packaging equipment for semiconductor production, the structure is simple and stable, the precision is convenient to control, a large number of sensors for detection and calibration are reduced, the energy consumption is reduced, the working time is shortened, the working stability of equipment is enhanced, the feeding process is stable, deformation or scrapping of the surface of a packaged semiconductor with low hardness is avoided, and the material taking speed is increased.

Description

technical field [0001] The invention relates to the technical field of semiconductor production, in particular to packaging equipment for semiconductor production. Background technique [0002] Semiconductors refer to materials whose conductivity is between that of conductors and insulators at room temperature. Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting applications, high-power power conversion and other fields, no matter from the perspective of technology or economic development. From the point of view, the importance of semiconductors is very huge. Common semiconductor materials include silicon, germanium, gallium arsenide, etc., and silicon is the most influential one in commercial applications among various semiconductor materials; [0003] During the production process of semiconductor packaging, it is necessary to wrap the semiconductor with a casing to protect the semiconductor c...

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Problems solved by technology

[0004] The purpose of the present invention is to provide a packaging equipment for semiconductor production, to at least solve the problems in the prior art that the feeding time of the conveying device is difficult to match with the packaging equipment and the semiconductor after packaging is removed by a manipulator is expensive and easily deformed and discarded

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