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Server liquid cooling system and liquid cooling method

A server and liquid cooling technology, which is applied in the direction of instruments, electrical digital data processing, digital data processing components, etc., can solve the problems of chassis sealing requirements, high insulation requirements for the motherboard and cooling liquid, and difficult implementation, so as to reduce the power of the system fan and server noise, reduced energy consumption, and easy-to-achieve effects

Inactive Publication Date: 2020-11-17
INSPUR SUZHOU INTELLIGENT TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The direct heat dissipation method usually immerses the server components in the cooling liquid to solve the heat dissipation problem, but the immersion server has high requirements for the sealing of the chassis and the insulation requirements for the motherboard and the cooling liquid, making it difficult to implement

Method used

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  • Server liquid cooling system and liquid cooling method

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Embodiment Construction

[0019] The preferred embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, so as to define the protection scope of the present invention more clearly.

[0020] see figure 1 with figure 2 , the embodiment of the present invention includes:

[0021] See figure 1 , a liquid cooling system for servers, including: a circulation system, a detection system, and a control system; the circulation system is composed of an internal heat-absorbing unit, an external heat-dissipating unit 4 and connecting pipelines 3, and the internal heat-absorbing unit is composed of a single-sided inflation plate Mechanical molding is made into the chassis 2, the chassis is provided with water inlet and outlet holes, and the inflation path 9 is arranged in the inflation plate. The inflation path 9 of the inflation plate ...

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Abstract

The invention discloses a server liquid cooling system and a liquid cooling method. The server liquid cooling system is composed of a circulation system, a detection system and a control system. The circulating system dissipates heat in the server, and real-time temperature control is achieved through the detection system and the control system. The circulating system is composed of a built-in heat absorption unit, a built-out heat dissipation unit and a connecting pipeline. The built-in heat absorption unit adopts a huffing plate as a server mainframe box to be combined with a mainboard. Theexternal heat dissipation unit dissipates heat in a water cooling or air conditioner external unit mode; the detection system monitors the temperature, and the control system receives the numerical value sent by the detection system to accurately control the temperature. By means of the mode, high-efficiency heat dissipation of the chip can be achieved through cooperation of the inflation plate and the mainboard, the energy utilization rate of the whole machine is increased, and the system fan power and the server noise are reduced; and meanwhile, the internal space requirement of the server is greatly reduced, so that the arrangement of the ultrahigh-density operation chip is easier to realize.

Description

technical field [0001] The invention relates to the field of server design, in particular to a server liquid cooling system and a liquid cooling method. Background technique [0002] With the increase of network connection speed and social data volume, people's demand for high-performance servers is becoming more and more urgent. The overall calorific value of the server also increases sharply with the increase of the power consumption of each component and the overall power consumption. Temperature will affect the mobility and threshold voltage of semiconductor devices. The increase in temperature will increase the delay of the circuit. At the same time, the high temperature will increase the high-energy carriers. Decrease in ability. Therefore, modern high-performance servers have higher and higher requirements for heat dissipation, and liquid cooling technology has emerged and been gradually applied to servers, attracting more and more attention. [0003] Liquid coolin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20G06F11/30
CPCG06F1/206G06F11/3058
Inventor 徐振华
Owner INSPUR SUZHOU INTELLIGENT TECH CO LTD
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