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3 results about "Server design" patented technology

A signal distortion processing method, device, apparatus and medium

PendingCN122388347ALogical operationsComplex programmable logic device
This application discloses a signal distortion processing method, apparatus, device, and medium, relating to the field of server design technology. Applied to complex programmable logic devices (CPLs), the method includes: debouncing and filtering a real-time acquired external signal to filter out instantaneous stray interference signals with a duration less than a filtering time threshold; performing multiple judgment processing on the debounced signal to be judged to generate multiple judgment results, including: constructing a purely digital delay circuit within the CPL for delayed judgment; repeatedly superimposing the signal to be judged onto the conditional statements of a state machine with a preset number of samplings to force the state machine to identify level signals and perform level signal superposition judgment; performing edge recognition judgment on the signal based on the global clock or frequency-divided sub-clock of the CPL; and performing combinational logic operations on the multiple judgment results to output a target valid signal. The technical solution of this application can improve the overall reliability of the server.
Owner:BEIJING TIANDI CHAOYUN TECH CO LTD

A liquid-cooled GPU server based on 4U chassis installation of multiple hard disk box PCIe cards

The utility model relates to a server design technical field, concretely relates to a kind of liquid cooling GPU server based on 4U cabinet installation multiple hard disk box PCIe card, and its technical key points are at: including box and server component, wherein, the server component is located in the box, further including air cooling module and liquid cooling module, the server component includes a mainboard, the air cooling module is located one end of the mainboard, the liquid cooling module is located the top of the mainboard, the liquid cooling module includes water distributor, liquid flow pipe and cold plate, the water distributor is located the top of air cooling module, for the distribution of low-temperature coolant and the collection of high-temperature coolant, the liquid flow pipe is used to connect the water distributor and the cold plate, the cold plate is located the side of the mainboard away from the air cooling module. Through the reasonable collocation of air cooling module and liquid cooling module, both the heat dissipation problem of two 500W high-power CPUs and 8 600W high-power GPUs is solved, noise is reduced, and PUE value is also reduced.
Owner:SHENZHEN TONGTAIYI INFORMATION TECH CO LTD