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Wafer cleaning equipment

A technology for cleaning equipment and wafers, used in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., to solve problems such as chamber turbulence, fluctuations in cleaning chamber exhaust pressure, and unstable factory exhaust pressure. To achieve the effect of reducing the computational intensity

Pending Publication Date: 2020-11-20
BEIJING SEMICORE PRECISION MICROELECTRONICS EQUIP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The cleaning chamber generally uses clean air to enter the cleaning chamber through the air filter, and then enter the exhaust pipe, so that the pressure difference between the cleaning chamber and the exhaust pipe is formed, and the cleaned particles enter the exhaust pipe through the wind pressure, thereby ensuring cleaning. The cleanliness of the chamber, the exhaust pipe is directly connected to the factory exhaust system, and the factory exhaust system is connected to multiple devices in the factory area, and the pressure of the factory exhaust may also be unstable, which will make the cleaning chamber Fluctuations in the exhaust air pressure will cause serious turbulence in the chamber, resulting in poor cleaning chamber environment and affecting the wafer cleaning effect

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] This embodiment provides a specific implementation of wafer cleaning equipment, such as figure 1 As shown, the cleaning chamber 4 is connected with an exhaust duct 6 and an air supply device 2, and the exhaust duct 6 is equipped with a first differential pressure detection device 1, a second differential pressure detection device 14 and an actuator 7, and the air supply device 2 Continuously provide the air volume for the cleaning chamber 4, so that there is a pressure difference between the cleaning chamber 4 and the exhaust duct 6, so that when the air enters the exhaust duct 6, the cleaned particles enter the exhaust duct 6 through the pressure difference. A pressure difference detection device 1 detects the pressure difference between the cleaning chamber 4 and the exhaust duct 6 in real time, and transmits the detected data to the controller 8, and the controller 8 analyzes the data, such as image 3 As shown, the controller 8 judges whether the detected differenti...

Embodiment 2

[0048] like Figure 5 As shown, the actuator 7 is set as a valve 13, the valve 13 has a driving device, the driving device has a signal receiver 12, the signal receiver 12 is connected to the controller 8 in communication, and the first differential pressure detection device 1 passes through the data acquisition system 9 Connected to the controller 8, when the controller 8 judges that the detected pressure difference value does not match the preset pressure difference value, it makes a signal to adjust the execution part 7, and sends the signal to the signal receiver 12, and the signal receiver 12 controls the The signal given by the device 8 adjusts the driving device (not shown in the figure), and the driving device adjusts the opening of the valve 13, and then adjusts the exhaust air volume in the exhaust duct 6, so as to control the cleaning chamber 4 and the exhaust air. Effect of pressure differential between pipes 6.

[0049] working principle:

[0050] The first pres...

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PUM

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Abstract

The invention provides wafer cleaning equipment, and belongs to the technical field of wafer cleaning systems. The equipment comprises: a cleaning chamber connected with an exhaust pipeline and suitable for being connected with an air supply device; an execution component arranged on the exhaust pipeline and suitable for adjusting the exhaust air rate in the exhaust pipeline; a first pressure difference detection device arranged on the exhaust pipeline and positioned between the execution component and the cleaning chamber; and a controller in communication connection with the execution component and the first pressure difference detection device. According to the invention, the first pressure difference detection device detects the pressure difference between the cleaning chamber and theexhaust pipeline in real time, and transmits the detected data to the controller, the controller analyzes the data and judges whether the pressure difference at the moment meets a preset pressure difference value, and if not, the controller adjusts the exhaust air rate by controlling the execution component, and then it is guaranteed that the pressure difference of the cleaning chamber to the exhaust pipeline is in a stable state.

Description

technical field [0001] The invention relates to the technical field of wafer cleaning systems, in particular to a wafer cleaning device. Background technique [0002] With the continuous development of semiconductor integrated circuit (Integrated circuit, IC) manufacturing technology, the minimum line width is getting smaller and smaller, the number of interconnection layers is increasing, and the diameter of the wafer is increasing. To realize multi-layer wiring, the surface of the wafer must have extremely high flatness, smoothness and cleanliness. In the prior art, chemical mechanical polishing (CMP) is generally used to globally planarize the wafer. [0003] After the CMP process, the wafer needs to be cleaned, and the cleanliness of the cleaning chamber will affect the particle size of the wafer. The cleaning chamber generally uses clean air to enter the cleaning chamber through the air filter, and then enter the exhaust pipe, so that the pressure difference between th...

Claims

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Application Information

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IPC IPC(8): H01L21/67
CPCH01L21/67017H01L21/67023H01L21/67253
Inventor 蒋锡兵张为强尹影孙铭泽
Owner BEIJING SEMICORE PRECISION MICROELECTRONICS EQUIP CO LTD