Silver solder and preparation method and application thereof

A technology of silver brazing filler metal and brazing filler metal, which is used in manufacturing tools, welding equipment, metal processing equipment, etc., can solve the problems of affecting product performance, large differences in substrates, low thermal conductivity, etc., to improve service life and anti-oxidation ability. Strong, excellent electrical and thermal conductivity

Active Publication Date: 2020-11-24
ZHENGZHOU RES INST OF MECHANICAL ENG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Traditional solder has high resistance, low thermal conductivity and low melting point
During the working process, the melting point and resistivity of the transition layer formed at the connection of the brazing interface are quite different from those of the matrix. When the current passes through this area, a sudden change is formed, and the interface is likely to become a weak zone, resulting in severe electrical erosion in this area during use. Premature failure, which in turn affects the performance of the entire product

Method used

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  • Silver solder and preparation method and application thereof

Examples

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Effect test

preparation example Construction

[0038] The preparation method of described silver solder provided by the present invention specifically comprises the following steps:

[0039] (a), after mixing silver powder, copper powder, carbon nanotubes, cerium powder and neodymium powder, carry out ball milling, and then press into a billet;

[0040] (b), sintering the green body obtained in step (a), and extruding the sintered billet into a rod-shaped billet or a sheet billet;

[0041] (c), the rod-shaped billet extruded by step (b) is rolled, drawn and reduced in diameter and processed into filamentary solder;

[0042] Alternatively, the sheet-shaped blank extruded in step (b) is rolled into a strip-shaped solder.

[0043] In some preferred embodiments of the present invention, in step (a), the ball milling process helps to optimize the performance of the material, and the ball-to-material ratio of the ball milling is 8:1~4:1 (such as 8:1, 7:1 1, 5:1, 4:1), the rotating speed of the ball mill is 600~1200r / min (such ...

Embodiment 1

[0052] a. Preparation of 20 kg of high-conductivity and corrosion-resistant Ag-based alloy. The composition requirements are: Ag70%, Cu27.2%, carbon nanotubes 2.1%, cerium 0.33% and neodymium 0.23%;

[0053]B, weighing raw material silver powder (purity is 99.99%) 14kg, copper powder (purity is 99.95%) 5.44kg, carbon nanotube (purity>98%) 0.42kg, cerium powder (purity is 99.5%) 66g and neodymium powder ( Purity is 99.5%) 46g;

[0054] c. On the basis of step b, put the raw materials into a planetary ball mill for high-energy ball milling, the ball-to-material ratio is 8:1, the ball milling speed is 600r / min, and the ball milling time is 6h;

[0055] d. On the basis of step c, put the ball-milled uniform raw material powder into the diameter In the steel mold, use an isostatic press to bidirectionally press the billet, and the forming pressure is 200MPa;

[0056] e. On the basis of step d, put the shaped blank into a vacuum sintering furnace, and react and sinter for 4 hours...

Embodiment 2

[0060] The preparation method is the same as in Example 1. In step a, the composition of the silver solder is 88.8% Ag, 10% Cu, 1% carbon nanotube, 0.1% cerium and 0.1% neodymium.

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Abstract

The invention provides a silver solder and a preparation method and application thereof. The silver solder is mainly prepared from the following components in percentage by mass: 10%-50% of copper, 1%-8% of carbon nanotubes, 0.1%-0.8% of cerium, 0.1%-0.5% of neodymium and the balance of silver. The silver solder comprises the copper, the carbon nanotubes, the cerium, the neodymium and the silver,has excellent electrical and thermal conductivity and good electrical erosion resistance, is used in the field of connection of dissimilar electrical materials, and can improve the current stability and erosion resistance at a connection position.

Description

technical field [0001] The invention relates to the technical field of brazing materials, in particular to a silver solder and its preparation method and application. Background technique [0002] At present, composite electrical products such as silver-copper composite melt and electrical contacts are mostly connected by brazing. Traditional solder has high resistance, low thermal conductivity and low melting point. During the working process, the melting point and resistivity of the transition layer formed at the junction of the brazing interface are quite different from those of the matrix. When the current passes through this area, a sudden change is formed, and the interface is likely to become a weak zone, resulting in severe electrical erosion in this area during use. Early failure, which in turn affects the performance of the entire product. Therefore, how to ensure the stability of the electrical properties and corrosion resistance of the connection area is a diff...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C5/08C22C9/00B23K35/30B23K35/40C22C1/04
CPCB23K35/3006B23K35/302B23K35/40C22C1/0425C22C1/0466C22C5/08C22C9/00
Inventor 张雷程亚芳侯江涛郝庆乐李永李涛
Owner ZHENGZHOU RES INST OF MECHANICAL ENG CO LTD
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