Nano-layer lubricated diamond grinding wheel grinding device based on shock wave cavitation effect

A technology of diamond grinding wheel and cavitation effect, which is applied in the direction of grinding automatic control device, grinding/polishing safety device, grinding/polishing equipment, etc., which can solve the problem that nanoparticles cannot respond to lubrication immediately and grinding fluid is difficult to enter grinding Problems such as the core area, to achieve the effect of improving the lubrication and cooling effect, small deformation, and fast formation speed

Active Publication Date: 2021-08-13
HUNAN INSTITUTE OF SCIENCE AND TECHNOLOGY
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Problems solved by technology

[0006] In view of the above problems, the present invention provides a nano-layer lubricated diamond grinding wheel grinding device based on the shock wave cavitation effect, which is used to solve the problem that the grinding fluid is difficult to enter the grinding core area due to the influence of the gas barrier layer during the grinding wheel grinding process. Problems with nanoparticles that do not immediately respond to lubrication inside the grinding zone

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  • Nano-layer lubricated diamond grinding wheel grinding device based on shock wave cavitation effect
  • Nano-layer lubricated diamond grinding wheel grinding device based on shock wave cavitation effect
  • Nano-layer lubricated diamond grinding wheel grinding device based on shock wave cavitation effect

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[0044] In order to enable those skilled in the art to better understand the solutions of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only It is an embodiment of a part of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative efforts shall fall within the protection scope of the present invention.

[0045] like Figure 1-5 As shown, this embodiment provides a nano-layer lubricated diamond grinding wheel grinding device based on the shock wave cavitation effect, and its essence is to use the shock wave generated by the impact of the impact ball to accelerate the nanoparticles to make it on the metal bond layer on the surface of the grinding wheel The...

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Abstract

The invention proposes a nano-layer lubricated diamond grinding wheel grinding device based on the shock wave cavitation effect, which is used to solve the problem that the grinding fluid is difficult to enter the grinding core area due to the influence of the gas barrier layer. Specifically, it includes the control system, acceleration module, shock wave acceleration module, processing module, and recovery module. Among them, the control system controls the operation of the device; the acceleration module is composed of an acceleration tube, a small Rafal tube, etc., which can make the nanoparticles obtain an initial velocity; it consists of an electromagnetic coil, an impact head, an impact ball, a wave condenser, and a large Lafal The shock wave speed-up module composed of equal components will generate two wave sources, one to clean the impurities on the surface of the grinding wheel, and the other to impact the nanoparticles with initial velocity to the surface of the grinding wheel to form a nano-layer; during the processing, the nanoparticles in the nano-layer are released autonomously in the grinding core area , to achieve self-lubricating cooling inside the grinding area; the recovery module is used to recover nanoparticles and realize their reuse. The device not only enhances the lubricating and cooling effect, but also complies with the concept of green development.

Description

technical field [0001] The invention relates to the technical field of lubricating and cooling in grinding, in particular pointing out a nano-layer lubricated diamond grinding wheel grinding device based on the shock wave cavitation effect. Background technique [0002] Grinding is widely used in the current processing industry because of its high processing precision and strong adaptability to workpiece materials. However, the energy consumed by grinding to remove a unit volume of material is far greater than that of other commonly used processing forms Nearly 90% of the consumed energy will gather in the grinding area in the form of grinding heat, which will lead to high temperature and high pressure in the grinding area, which will affect the service life of the abrasive tool and reduce the surface accuracy of the workpiece. [0003] The traditional pouring lubrication adopts the method of continuous irrigation of a large amount of grinding fluid to the grinding area for ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24B41/00B24B51/00B24B55/03
CPCB24B55/03B24B51/00B24B41/00
Inventor 张晓红张松辉尉迟广智段佳蒋如意周莹英
Owner HUNAN INSTITUTE OF SCIENCE AND TECHNOLOGY
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