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Spiral scanning laser machining device and method

A helical scanning and laser processing technology, applied in laser welding equipment, metal processing equipment, manufacturing tools, etc., can solve the problems of small processing aperture, low precision of micro-hole taper adjustment, low processing efficiency, etc., to achieve high processing efficiency, improve Machining accuracy and machining efficiency, and the effect of improving machining accuracy

Inactive Publication Date: 2020-12-01
XI'AN INST OF OPTICS & FINE MECHANICS - CHINESE ACAD OF SCI
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

[0003] The purpose of the present invention is to solve the problems of low microhole taper adjustment accuracy, small processing aperture and low processing efficiency in the existing laser processing device, and provide a helical scanning laser processing device and processing method

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  • Spiral scanning laser machining device and method
  • Spiral scanning laser machining device and method

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Embodiment Construction

[0022] The content of the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. However, these embodiments do not limit the present invention, and any structural, method, or functional changes made by those skilled in the art according to these embodiments are included in the protection scope of the present invention.

[0023] The invention provides a helical scanning laser processing device and processing method, through which the high-precision adjustment of microhole taper can be realized, the maximum processing aperture can reach 2mm, and the spiral scanning trajectory of the beam is adopted, so the processing efficiency is high.

[0024] Such as figure 1 As shown, the spiral scanning laser processing device of the present invention includes a displacement mirror 1, a Dove prism 2, an upper deflection wedge 3, a lower deflection wedge 4, and a focusing mirror 5 arranged in sequence along the opti...

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Abstract

The invention provides a spiral scanning laser machining device and method, and aims to solve the problems that an existing laser machining device is low in micropore taper adjusting precision, smallin machining hole diameter and low in machining efficiency. The spiral scanning laser machining device comprises a displacement reflector, a Dove prism, an upper deflection optical wedge, a lower deflection optical wedge and a focus lens which are sequentially arranged along an optical path, wherein the upper deflection optical wedge and the lower deflection optical wedge are arranged back to back; the central axes of the upper deflection optical wedge and the lower deflection optical wedge are coaxial with the central axis of the Dove prism; and laser beams are incident to the Dove prism after micropore taper adjustment is realized through the displacement reflector, the Dove prism increases the scanning speed of the laser beams and then enables the laser beams to enter the upper deflection optical wedge and the lower deflection optical wedge, the upper deflection optical wedge and the lower deflection optical wedge deflect the laser beams to achieve scanning of the laser beams with different diameters, and the focus lens focuses the laser beams, so that spiral scanning machining of micropores is achieved. According to the device and method, the machining precision and the machining efficiency of the laser machining device during micropore machining are improved.

Description

technical field [0001] The invention belongs to the field of laser precision manufacturing, and in particular relates to a helical scanning laser processing device and a processing method. Background technique [0002] At present, the processing devices widely used in high-quality laser manufacturing of microholes are mainly divided into two types according to the optical devices used inside: one is the optical wedge processing head, which uses the refraction effect of the optical wedge on the beam to realize microholes with different tapers. Laser processing; the second is the Dove prism processing head, which utilizes the doubling characteristics of the beam speed by the Dove prism to achieve high-speed rotation of the beam, thereby realizing efficient and high-quality processing of micro-holes. However, these two types of processing heads have the following problems: 1) Due to the wedge angle error and mechanical vibration of the optical wedge processing head, there are p...

Claims

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Application Information

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IPC IPC(8): B23K26/082B23K26/064B23K26/70
CPCB23K26/0643B23K26/082B23K26/702
Inventor 李明江浩田新锋
Owner XI'AN INST OF OPTICS & FINE MECHANICS - CHINESE ACAD OF SCI
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