4results about How to "Reduce control precision requirements" patented technology

The invention discloses an efficient and low-cost production method of thin-specification and high-grade non-oriented silicon steel. The production method comprises the steps that the initial rolling temperature of hot rolling and finish rolling is larger than or equal to 950 DEG C, the finish rolling temperature is (830-880) + / -15 DEG C, and the coiling temperature is (600-650) + / -15 DEG C; acid continuous rolling, wherein a multi-rack acid continuous rolling unit is adopted for acid pickling and multi-pass cold rolling; normalizing a rolled hard board, wherein the normalizing temperature is (850-1000) + / -10 DEG C, and the tension in a normalizing furnace is 8-10N / mm < 2 >; performing single-stand finish cold rolling: performing finish cold rolling by adopting a single-stand rolling mill; and annealing, wherein the annealing temperature is 850-1050 DEG C, and a finished product with the thickness of (0.15-0.50) + / -0.003 mm is obtained. A specific process combination of normalizing after obtaining a rolled hard plate through acid continuous rolling and then carrying out single-rack finish cold rolling is adopted, so that the existing hot-rolled plate normalizing technology is replaced, and the unification of high efficiency, low cost and high quality is achieved.

This invention relates to a tail fin structure with independent pitch and roll movements, comprising a pitch mechanism, a roll mechanism, and a connecting mechanism. The pitch mechanism includes a pitch servo and a pitch linkage, while the roll mechanism includes a roll servo and a transmission gear. The connecting mechanism includes a universal joint and a universal joint limiter. The pitch servo drives the tail fin to pitch movement via the pitch linkage. The roll servo drives the universal joint to rotate via the transmission gear, with the tail end of the universal joint connected to the tail fin to complete the roll movement. The rotation center of the pitch mechanism coincides with the center of the universal joint, and the left and right swing degrees of freedom of the universal joint are limited by the universal joint limiter, achieving independent control of pitch and roll movements. This invention allows for completely independent roll and pitch movements, significantly reducing the control precision requirements of the motor. The invention has a simple structure and reasonable design. The single-plane tail fin structure of this invention has strong wind resistance during flight and also has advantages such as low inertial load on the motor and high drive efficiency.

The invention discloses an elevator secondary leveling operation control method which comprises the following steps: S1, when an elevator is in a deceleration operation state, monitoring a speed instruction output by an elevator control system; s2, when the speed instruction is zero, the height difference between a car floor and a floor sill is obtained; s3, when the height difference is larger than a trigger threshold value, a door lock loop is short-circuited; s4, calculating a secondary leveling operation speed instruction according to the height difference; and S5, secondary leveling operation is executed. According to the method, the requirement for the control performance in the deceleration process is low, and the leveling precision is high.

The embodiment of the invention provides a through hole forming method of a package substrate, relates to the field of semiconductor processes, and mainly solves the problems of low etching speed, low hole forming efficiency or poor hole forming process in the existing through hole process of the package substrate. The method comprises the following steps: defining a through hole position on a packaging substrate; forming a first electrode at the position of the through hole in the first surface and forming a second electrode at the position of the through hole in the second surface by adopting a mask; pre-discharging the first electrode and the second electrode to form an electric breakdown area at the position of the through hole; removing the first electrode and the second electrode; reusing the mask, forming a first mask layer on the first surface, exposing the positions of the through holes by the first mask layer, and forming a second mask layer on the second surface, exposing the positions of the through holes by the second mask layer; and through the first mask layer and the second mask layer, etching to remove the electric breakdown region at the position of the through hole so as to form the through hole. Porous batch discharge is supported, and the discharge machining efficiency is greatly improved.